MJF15030 (NPN),
MJF15031 (PNP)
Complementary Power
Transistors
For Isolated Package Applications
Designed for general−purpose amplifier and switching applications,
where the mounting surface of the device is required to be electrically
isolated from the heatsink or chassis.
http://onsemi.com
COMPLEMENTARY SILICON
POWER TRANSISTORS
8 AMPERES
Features
• Electrically Similar to the Popular MJE15030 and MJE15031
• 150 V
CEO(sus)
150 VOLTS, 36 WATTS
• 8 A Rated Collector Current
• No Isolating Washers Required
• Reduced System Cost
MARKING
DIAGRAM
• High Current Gain−Bandwidth Product −
f = 30 MHz (Min) @ I
T
C
= 500 mAdc
• UL Recognized, File #E69369, to 3500 V
• Pb−Free Packages are Available*
Isolation
RMS
TO−220 FULLPACK
MAXIMUM RATINGS
MJF1503xG
AYWW
1
CASE 221D
STYLE 2
2
3
Rating
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Symbol
Value
150
150
5
Unit
Vdc
Vdc
Vdc
V
CEO
V
CB
V
EB
RMS Isolation Voltage (Note 1)
V
V
RMS
ISOL
Test No. 1 Per Figure 11
4500
3500
1500
Test No. 2 Per Figure 12
Test No. 3 Per Figure 13
MJF1503x = Specific Device Code
x = 0 or 1
(for 1 sec, R.H. < 30%, T = 25_C)
A
Collector Current − Continuous
− Peak
I
C
8
16
Adc
Adc
G
A
Y
= Pb−Free Package
= Assembly Location
= Year
Base Current
I
B
2
Total Power Dissipation (Note 2) @ T = 25_C
P
36
W
WW
= Work Week
C
D
0.016
W/_C
Derate above 25_C
Total Power Dissipation @ T = 25_C
P
D
2.0
0.016
W
A
Derate above 25_C
W/_C
ORDERING INFORMATION
Operating and Storage Temperature Range
THERMAL CHARACTERISTICS
T , T
J
–65 to +150
_C
stg
Device
Package
Shipping
Characteristic
Symbol
Max
62.5
3.5
Unit
_C/W
_C/W
_C
MJF15030
TO−220 FULLPACK 50 Units/Rail
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case (Note 2)
Lead Temperature for Soldering Purposes
R
MJF15030G
TO−220 FULLPACK 50 Units/Rail
(Pb−Free)
q
JA
R
q
JC
MJF15031
TO−220 FULLPACK 50 Units/Rail
T
L
260
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
MJF15031G TO−220 FULLPACK 50 Units/Rail
(Pb−Free)
1. Proper strike and creepage distance must be provided.
2. Measurement made with thermocouple contacting the bottom insulated
surface (in a location beneath the die), the devices mounted on a heatsink with
thermal grease and a mounting torque of ≥ 6 in. lbs.
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
April, 2006 − Rev. 5
MJF15030/D