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MGFC39V7177A_04 PDF预览

MGFC39V7177A_04

更新时间: 2024-11-30 03:15:43
品牌 Logo 应用领域
三菱 - MITSUBISHI /
页数 文件大小 规格书
2页 184K
描述
7.1 ~ 7.7GHz BAND 8W INTERNALLY MATCHED GaAs FET

MGFC39V7177A_04 数据手册

 浏览型号MGFC39V7177A_04的Datasheet PDF文件第2页 
MITSUBISHI SEMICONDUCTOR <GaAs FET>  
MGFC39V7177A  
7.1 ~ 7.7GHz BAND 8W INTERNALLY MATCHED GaAs FET  
DESCRIPTION  
The MGFC39V7177A is an internally impedance-matched  
GaAs power FET especially designed for use in 7.1 ~ 7.7 GHz  
band amplifiers.The hermetically sealed metal-ceramic  
package guarantees high reliability.  
OUTLINE DRAWING Unit : millimeters  
FEATURES  
Class A operation  
0.6 +/-0.15  
Internally matched to 50(ohm) system  
High output power  
(2)  
(2)  
P1dB = 8W (TYP.) @ f=7.1~7.7GHz  
High power gain  
R-1.6  
GLP = 8 dB (TYP.) @ f=7.1~7.7GHz  
High power added efficiency  
P.A.E. = 28 % (TYP.) @ f=7.1~7.7GHz  
Low distortion [ item -51 ]  
(3)  
IM3= -45 dBc(TYP.) @Po=28dBm S.C.L.  
APPLICATION  
item 01 : 7.1~7.7 GHz band power amplifier  
item 51 : 7.1~7.7 GHz band digital radio communication  
QUALITY GRADE  
IG  
RECOMMENDED BIAS CONDITIONS  
VDS = 10 (V)  
(1) GATE  
(2) SOURCE (FLANGE)  
(3) DRAIN  
GF-8  
ID = 2.4 (A)  
Refer to Bias Procedure  
RG= 50 (ohm)  
(Ta=25 deg.C)  
ABSOLUTE MAXIMUM RATINGS  
< Keep safety first in your circuit designs! >  
Symbol  
VGDO  
VGSO  
ID  
Parameter  
Gate to drain voltage  
Gate to source voltage  
Drain current  
Ratings  
Unit  
V
Mitsubishi Electric Corporation puts the maximum effort into  
making semiconductor products better and more reliable, but  
there is always the possibility that trouble may occur with them.  
Trouble with semiconductors may lead to personal injury, fire or  
property damage. Remember to give due consideration to safety  
when making your circuit designs, with appropriate measures  
such as (1)placement of substitutive, auxiliary circuits, (2)use of  
non-flammable material or (3)prevention against any malfunction  
or mishap.  
-15  
-15  
V
7.5  
A
IGR  
Reverse gate current  
Forward gate current  
Total power dissipation *1  
Channel temperature  
Storage temperature  
-20  
mA  
mA  
W
IGF  
42  
PT  
42.8  
175  
Tch  
deg.C  
deg.C  
Tstg  
-65 / +175  
*1 : Tc=25 deg.C  
(Ta=25 deg.C)  
ELECTRICAL CHARACTERISTICS  
Limits  
Symbol  
Parameter  
Test conditions  
Unit  
Min.  
Typ.  
Max.  
IDSS  
gm  
Saturated drain current  
Transconductance  
VDS=3V, VGS=0V  
VDS=3V, ID=2.2A  
VDS=3V, ID=20mA  
-
-
-
2
7.5  
A
S
-
Gate to source cut-off voltage  
Output power at 1dB gain compression  
Linear power gain  
VGS(off)  
P1dB  
GLP  
ID  
-
-
-4.5  
V
38  
7
39.5  
8
-
-
dBm  
dB  
A
VDS=10V, ID(RF off)=2.4A, f=7.1~7.7GHz  
Drain current  
-
-
3
-
P.A.E.  
IM3  
Power added efficiency  
-
28  
-45  
-
%
3rd order IM distortion  
*1  
*2  
-42  
-
-
dBc  
Rth(ch-c) Thermal resistance  
Delta Vf method  
3.5 deg.C/W  
*1 : item -51, 2 tone test, Po=28dBm Single Carrier Level, f=7.7GHz, Delta f=10MHz  
*2 : Channel to case  
June/2004  
MITSUBISHI  
ELECTRIC  

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