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MGFC40V5964_11 PDF预览

MGFC40V5964_11

更新时间: 2024-09-18 11:02:11
品牌 Logo 应用领域
三菱 - MITSUBISHI /
页数 文件大小 规格书
2页 90K
描述
C band internally matched power GaAs FET

MGFC40V5964_11 数据手册

 浏览型号MGFC40V5964_11的Datasheet PDF文件第2页 
< C band internally matched power GaAs FET >  
MGFC40V5964  
5.9 – 6.4 GHz BAND / 10W  
OUTLINE DRAWING  
Unit: millimeters (inches)  
24+/-0.3  
DESCRIPTION  
The MGFC40V5964 is an internally impedance-matched  
GaAs power FET especially designed for use in 5.9 – 6.4  
GHz band amplifiers. The hermetically sealed metal-ceramic  
package guarantees high reliability.  
R1.25  
(1)  
0.6+/-0.15  
FEATURES  
Class A operation  
R1.2  
Internally matched to 50(ohm) system  
High output power  
P1dB=10W (TYP.) @f=5.9 – 6.4GHz  
High power gain  
(2)  
GLP=10dB (TYP.) @f=5.9 – 6.4GHz  
High power added efficiency  
P.A.E.=30% (TYP.) @f=5.9 – 6.4GHz  
Low distortion [item -51]  
(3)  
IM3=-49dBc (TYP.) @Po=29dBm S.C.L  
20.4+/-0.2  
13.4  
APPLICATION  
item 01 : 5.9 – 6.4 GHz band power amplifier  
item 51 : 5.9 – 6.4 GHz band digital radio communication  
QUALITY  
IG  
(1): GATE  
(2): SOURCE (FLANGE)  
(3): DRAIN  
RECOMMENDED BIAS CONDITIONS  
VDS=10V ID=2.4A RG=50ohm Refer to Bias Procedure  
GF-18  
Absolute maximum ratings (Ta=25C)  
Keep Safety first in your circuit designs!  
Mitsubishi Electric Corporation puts the maximum  
effort into making semiconductor products better  
and more reliable , but there is always the  
possibility that trouble may occur with them.  
Trouble with semiconductors may lead to personal  
injury , fire or property damage. Remember to give  
due consideration to safety when making your  
circuit designs , with appropriate measure such  
as (I) placement of substitutive , auxiliary circuits ,  
(ii) use of non-flammable material or (iii) prevention  
against any malfunction or mishap.  
Symbol  
Parameter  
Ratings  
Unit  
V
Gate to drain  
VGDO  
breakdown voltage  
-15  
VGSO Gate to source breakdown voltage  
-15  
V
ID  
Drain current  
7.5  
A
IGR  
IGF  
PT *1  
Tch  
Reverse gate current  
Forward gate current  
Total power dissipation  
Cannel temperature  
Storage temperature  
-20  
mA  
mA  
W
42  
42.8  
175  
C  
C  
Tstg  
-65 to +175  
*1 : Tc=25C  
Electrical characteristics  
(Ta=25C)  
Symbol  
Parameter  
Test conditions  
Limits  
Typ.  
4.5  
2
Unit  
Min.  
Max.  
Saturated drain current  
Transconductance  
VDS=3V,VGS=0V  
-
6
-
A
S
IDSS  
VDS=3V,ID=2.2A  
VDS=3V,ID=40mA  
-
-2  
39.5  
8
gm  
Gate to source cut-off voltage  
-3  
-4  
-
V
VGS(off)  
P1dB  
GLP  
Output power at 1dB gain compression VDS=10V,ID(RF off)=2.4A  
40.5  
10  
dBm  
dB  
A
f=5.9 – 6.4GHz  
Linear Power Gain  
Drain current  
-
ID  
-
2.4  
30  
-
P.A.E.  
IM3 *2  
Rth(ch-c) *3  
Power added efficiency  
3rd order IM distortion  
Thermal resistance  
-
-
%
-42  
-
-49  
3
-
dBc  
C/W  
delta Vf method  
3.5  
*2 :item -51 ,2 tone test,Po=29dBm Single Carrier Level ,f=6.4GHz,delta f=10MHz  
*3 :Channel-case  
Publication Date : Apr., 2011  
1

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