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MGFC41V3642 PDF预览

MGFC41V3642

更新时间: 2024-12-01 04:10:43
品牌 Logo 应用领域
三菱 - MITSUBISHI /
页数 文件大小 规格书
2页 222K
描述
3.6 - 4.2GHz BAND 12W INTERNALLY MATCHED GaAs FET

MGFC41V3642 技术参数

生命周期:Obsolete包装说明:FLANGE MOUNT, R-CDFM-F2
针数:2Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.84
其他特性:HIGH RELIABILITY外壳连接:SOURCE
配置:SINGLE最小漏源击穿电压:10 V
最大漏极电流 (Abs) (ID):12 A最大漏极电流 (ID):3.4 A
FET 技术:JUNCTION最高频带:C BAND
JESD-30 代码:R-CDFM-F2元件数量:1
端子数量:2工作模式:DEPLETION MODE
最高工作温度:175 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
极性/信道类型:N-CHANNEL功耗环境最大值:57.7 W
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子形式:FLAT
端子位置:DUAL晶体管应用:AMPLIFIER
晶体管元件材料:GALLIUM ARSENIDEBase Number Matches:1

MGFC41V3642 数据手册

 浏览型号MGFC41V3642的Datasheet PDF文件第2页 
MITSUBISHI SEMICONDUCTOR <GaAs FET>  
MGFC41V3642  
3.6 - 4.2GHz BAND 12W INTERNALLY MATCHED GaAs FET  
DESCRIPTION  
The MGFC41V3642 is an internally impedence matched  
GaAs power FET especially designed for use in 3.6 - 4.2  
GHz band amplifiers. The hermetically sealed metal-ceramic  
package guarantees high raliability.  
OUTLINE DRAWING  
Unit: millimeters (inches)  
24+/-0.3  
(1)  
R1.25  
0.6+ /-0.15  
FEATURES  
Internally matched to 50ohm system  
R1.2  
High output power  
P1dB = 14W (TIP.) @ f=3.6 - 4.2 Hz  
High power gain  
(2)  
GLP = 12.5 dB (TYP.) @ f=3.6 - 4.2 GHz  
High power added efficiency  
Eadd = 40 % (TYP.) @ f=3.6 - 4.2 GHz  
Low Distortion[Item-51]  
(3)  
IM3=-45 dBc(TYP.)@Po=30dBm S.C.L.  
20.4+/-0.2  
APPLICATION  
item 01 : 3.6 - 4.2 GHz band power amplifier  
13.4  
item 51 : 3.6 - 4.2 GHz band digital radio communication  
QUALITY GRADE  
IG  
RECOMMENDED BIAS CONDITIONS  
VDS = 10(V)  
(1): GATE  
(2): SOURCE (FLANGE)  
(3): DRAIN  
ID = 3.4 (A)  
Rg = 50(ohm) Refer to Bias Procedure  
GF-18  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
VGDO  
VGSO  
ID  
Parameter  
Gate to drain voltage  
Gate to source voltage  
Drain current  
Ratings  
-15  
Unit  
V
-15  
V
A
12  
IGR  
Reverse gate current  
Forward gate current  
Total power dissipation *1  
Channel temperature  
Storage temperature  
-30  
mA  
IGF  
63  
mA  
PT  
53.6  
175  
W
Tch  
Tstg  
DegreesC  
DegreesC  
-65 / +175  
*1 : Tc=25 DegreesC  
ABSOLUTE MAXIMUM RATINGS  
Limits  
Symbol  
Parameter  
Test conditions  
Unit  
Max  
Min  
Typ  
IDSS  
gm  
Saturated drain current  
Transconductance  
VDS = 3V , VGS = 0V  
-
-
-
-
3
-
12  
-
A
S
V
VDS = 3V , ID = 3.0A  
VDS = 3V , ID = 30mA  
VGS(off)  
Gate to source cut-off voltage  
-5  
Output power at 1dB gain  
compression  
P1dB  
40  
41.5  
-
dBm  
GLP  
ID  
Linear power gain  
Drain current  
VDS = 10V , ID = 3.4A , f = 3.6 - 4.2 GHz  
11  
12.5  
3.3  
40  
-
-
dB  
A
-
-
Eadd  
IM3 *2  
Power added efficiency  
3rd order IM distortion  
-
%
-42  
-
-45  
-
-
dBc  
deg.C/W  
Rth(ch-c) Thermal resistance *1  
*1 : Channel to case  
Delta Vf method  
2.8  
*2 : Item-51,2tone test,Po=30dBm Single Carrier Level,f=4.2GHz,Delta f=10MHz  
Oct-'03  
MITSUBISHI  
ELECTRIC  

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