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JS28F00AP30EF

更新时间： 2024-02-17 01:30:23
品牌 Logo 应用领域
镁光 - MICRON 闪存存储内存集成电路光电二极管
页数 文件大小 规格书
92页 1225K
描述
Micron Parallel NOR Flash Embedded Memory (P30-65nm)

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JS28F00AP30EF 技术参数

是否Rohs认证： 符合生命周期：Obsolete
包装说明：TSSOP, TSSOP56,.8,20Reach Compliance Code：unknown
风险等级：5.79最长访问时间：110 ns
启动块：TOP命令用户界面：YES
通用闪存接口：YES数据轮询：NO
JESD-30 代码：R-PDSO-G56内存密度：1073741824 bit
内存集成电路类型：FLASH内存宽度：16
部门数/规模：4,1023端子数量：56
字数：67108864 words字数代码：64000000
最高工作温度：85 °C最低工作温度：-40 °C
组织：64MX16封装主体材料：PLASTIC/EPOXY
封装代码：TSSOP封装等效代码：TSSOP56,.8,20
封装形状：RECTANGULAR封装形式：SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
页面大小：16 words并行/串行：PARALLEL
电源：1.8,1.8/3.3 V认证状态：Not Qualified
部门规模：16K,64K最大待机电流：0.00024 A
子类别：Flash Memories最大压摆率：0.031 mA
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子形式：GULL WING
端子节距：0.5 mm端子位置：DUAL
切换位：NO类型：NOR TYPE
Base Number Matches：1

JS28F00AP30EF 数据手册

 浏览型号JS28F00AP30EF的Datasheet PDF文件第1页浏览型号JS28F00AP30EF的Datasheet PDF文件第3页浏览型号JS28F00AP30EF的Datasheet PDF文件第4页浏览型号JS28F00AP30EF的Datasheet PDF文件第5页浏览型号JS28F00AP30EF的Datasheet PDF文件第6页浏览型号JS28F00AP30EF的Datasheet PDF文件第7页 
512Mb, 1Gb, 2Gb: P30-65nm  
Features  
Discrete and MCP Part Numbering Information  
Devices are shipped from the factory with memory content bits erased to 1. For available options, such as pack-  
ages or for further information, contact your Micron sales representative. Part numbers can be verified at www.mi-  
cron.com. Feature and specification comparison by device type is available at www.micron.com/products. Con-  
tact the factory for devices not found.  
Note: Not all part numbers listed here are available for ordering.  
Table 1: Discrete Part Number Information  
Part Number Category  
Category Details  
Package  
JS = 56-lead TSOP, lead free  
PC = 64-ball Easy BGA, lead-free  
RC = 64-ball Easy BGA, leaded  
28F = Micron Flash memory  
Product Line  
Density  
512 = 512Mb  
00A = 1Gb  
00B = 2Gb  
Product Family  
P30 (VCC = 1.7–2.0V; VCCQ = 1.7–3.6V)  
Parameter Location  
B/T = Bottom/Top parameter  
E = Symmetrical Blocks  
Lithography  
Features  
F = 65nm  
*
1. The last digit is assigned randomly to cover packaging media, features, or other specific configuration infor-  
mation. Sample part number: JS28F512P30EF*  
Note:  
Table 2: Standard Part Numbers  
Density  
Configuration  
Medium  
Tray  
JS  
PC  
RC  
512Mb  
Bottom boot  
JS28F512P30BFA  
PC28F512P30BFA  
PC28F512P30BFB  
PC28F512P30TFA  
PC28F512P30TFB  
PC28F512P30EFA  
–
–
Tape & Reel  
Tray  
–
–
Top boot  
Uniform  
JS28F512P30TFA  
–
Tape & Reel  
Tray  
–
–
JS28F512P30EFA  
–
Tape & Reel  
Tray  
–
–
1Gb  
Bottom boot  
Top boot  
Uniform  
JS28F00AP30BFA  
PC28F00AP30BFA  
PC28F00AP30BFB  
PC28F00AP30TFA  
–
RC28F00AP30BFA  
Tape & Reel  
Tray  
–
–
JS28F00AP30BTFA  
RC28F00AP30TFA  
Tape & Reel  
Tray  
–
–
–
–
–
–
JS28F00AP30EFA  
PC28F00AP30EFA  
–
Tape & Reel  
Tray  
–
–
–
2Gb  
Uniform  
PC28F00BP33EFA  
–
Tape & Reel  
PDF: 09005aef845667b3  
p30_65nm_MLC_512Mb-1gb_2gb.pdf - Rev. B 12/13 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
2
© 2013 Micron Technology, Inc. All rights reserved.  
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