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JS28F00AP30EF

更新时间: 2024-01-18 01:19:09
品牌 Logo 应用领域
镁光 - MICRON 闪存存储内存集成电路光电二极管
页数 文件大小 规格书
92页 1225K
描述
Micron Parallel NOR Flash Embedded Memory (P30-65nm)

JS28F00AP30EF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:TSSOP, TSSOP56,.8,20Reach Compliance Code:unknown
风险等级:5.79最长访问时间:110 ns
启动块:TOP命令用户界面:YES
通用闪存接口:YES数据轮询:NO
JESD-30 代码:R-PDSO-G56内存密度:1073741824 bit
内存集成电路类型:FLASH内存宽度:16
部门数/规模:4,1023端子数量:56
字数:67108864 words字数代码:64000000
最高工作温度:85 °C最低工作温度:-40 °C
组织:64MX16封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP56,.8,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
页面大小:16 words并行/串行:PARALLEL
电源:1.8,1.8/3.3 V认证状态:Not Qualified
部门规模:16K,64K最大待机电流:0.00024 A
子类别:Flash Memories最大压摆率:0.031 mA
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
切换位:NO类型:NOR TYPE
Base Number Matches:1

JS28F00AP30EF 数据手册

 浏览型号JS28F00AP30EF的Datasheet PDF文件第3页浏览型号JS28F00AP30EF的Datasheet PDF文件第4页浏览型号JS28F00AP30EF的Datasheet PDF文件第5页浏览型号JS28F00AP30EF的Datasheet PDF文件第7页浏览型号JS28F00AP30EF的Datasheet PDF文件第8页浏览型号JS28F00AP30EF的Datasheet PDF文件第9页 
512Mb, 1Gb, 2Gb: P30-65nm  
Features  
List of Tables  
Table 1: Discrete Part Number Information ...................................................................................................... 2  
Table 2: Standard Part Numbers ....................................................................................................................... 2  
Table 3: Virtual Chip Enable Truth Table for Easy BGA Packages ........................................................................ 8  
Table 4: TSOP and Easy BGA Signal Descriptions ............................................................................................ 15  
Table 5: Bus Operations ................................................................................................................................. 17  
Table 6: Command Codes and Definitions ...................................................................................................... 19  
Table 7: Command Bus Cycles ....................................................................................................................... 22  
Table 8: Device ID Information ...................................................................................................................... 25  
Table 9: Device ID codes ................................................................................................................................ 26  
Table 10: BEFP Requirements ........................................................................................................................ 29  
Table 11: BEFP Considerations ...................................................................................................................... 29  
Table 12: Status Register Description .............................................................................................................. 37  
Table 13: Read Configuration Register ............................................................................................................ 39  
Table 14: End of Wordline Data and WAIT State Comparison ........................................................................... 42  
Table 15: WAIT Functionality Table ................................................................................................................ 42  
Table 16: Burst Sequence Word Ordering ........................................................................................................ 43  
Table 17: Example of CFI Output (x16 device) as a Function of Device and Mode ............................................. 48  
Table 18: CFI Database: Addresses and Sections ............................................................................................. 49  
Table 19: CFI ID String ................................................................................................................................... 49  
Table 20: System Interface Information .......................................................................................................... 50  
Table 21: Device Geometry ............................................................................................................................ 51  
Table 22: Block Region Map Information ........................................................................................................ 51  
Table 23: Primary Vendor-Specific Extended Query ........................................................................................ 52  
Table 24: Optional Features Field ................................................................................................................... 54  
Table 25: One Time Programmable (OTP) Space Information .......................................................................... 54  
Table 26: Burst Read Information ................................................................................................................... 55  
Table 27: Partition and Block Erase Region Information .................................................................................. 56  
Table 28: Partition Region 1 Information: Top and Bottom Offset/Address ....................................................... 57  
Table 29: Partition Region 1 Information ........................................................................................................ 57  
Table 30: Partition Region 1: Partition and Erase Block Map Information ......................................................... 60  
Table 31: CFI Link Information – 2Gb ............................................................................................................. 61  
Table 32: Power and Reset .............................................................................................................................. 71  
Table 33: Maximum Ratings ........................................................................................................................... 73  
Table 34: Operating Conditions ...................................................................................................................... 73  
Table 35: DC Current Characteristics .............................................................................................................. 74  
Table 36: DC Voltage Characteristics .............................................................................................................. 75  
Table 37: Test Configuration: Worst-Case Speed Condition .............................................................................. 76  
Table 38: Capacitance .................................................................................................................................... 77  
Table 39: AC Read Specifications .................................................................................................................... 78  
Table 40: AC Write Specifications ................................................................................................................... 85  
Table 41: Program and Erase Specifications .................................................................................................... 91  
PDF: 09005aef845667b3  
p30_65nm_MLC_512Mb-1gb_2gb.pdf - Rev. B 12/13 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
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© 2013 Micron Technology, Inc. All rights reserved.  

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