HiPerFETTM
VDSS
ID25
RDS(on)
IXFK72N20 200V 72 A 35 mW
IXFK80N20 200V 80 A 30 mW
trr £ 200 ns
Power MOSFETs
N-Channel Enhancement Mode
Avalanche Rated, High dv/dt, Low trr
Preliminary data
Symbol
TestConditions
MaximumRatings
TO-264 AA
VDSS
VDGR
TJ = 25°C to 150°C
200
200
V
V
TJ = 25°C to 150°C; RGS = 1 MW
G
VGS
Continuous
Transient
±20
±30
V
V
(TAB)
D
S
VGSM
ID25
TC = 25°C
72N20
80N20
72
80
A
A
G = Gate
S = Source
D = Drain
TAB = Drain
IDM
TC = 25°C,
pulse width limited by TJM
72N20
80N20
288
320
A
A
IAR
TC = 25°C
TC = 25°C
74
45
5
A
mJ
EAR
dv/dt
IS £ IDM, di/dt £ 100 A/ms, VDD £ VDSS
TJ £ 150°C, RG = 2 W
,
V/ns
PD
TC = 25°C
360
W
Features
TJ
-55 ... +150
150
°C
°C
°C
• Internationalstandardpackages
• Molding epoxies meet UL94V-0
flammabilityclassification
TJM
Tstg
-55 ... +150
• Low RDS (on) HDMOSTM process
TL
1.6 mm (0.063 in) from case for 10 s
Mountingtorque
300 -
0.9/6
°C
• Unclamped Inductive Switching (UIS)
rated
Md
Nm/lb.in.
• Fast intrinsic rectifier
Weight
Symbol
10
g
Applications
TestConditions
CharacteristicValues
(TJ = 25°C, unless otherwise specified)
• DC-DC converters
• Synchronousrectification
• Battery chargers
min. typ. max.
• Switched-modeandresonant-mode
powersupplies
• DC choppers
VDSS
VGS = 0 V, ID = 1 mA
VDS = VGS, ID = 4 mA
200
2
V
VGS(th)
4
V
• Temperatureandlightingcontrols
IGSS
IDSS
VGS = ±20 VDC, VDS = 0
±100
nA
VDS = 0.8 • VDSS
VGS = 0 V
TJ = 25°C
TJ = 125°C
200
1
mA
mA
Advantages
RDS(on)
VGS = 10 V,ID = 0.5 • ID25
72N20
80N20
35 mW
30 mW
• Easy to mount
• Space savings
• High power density
Pulse test, t £ 300 ms, duty cycle d £ 2 %
IXYS reserves the right to change limits, test conditions, and dimensions.
© 2000 IXYS All rights reserved
97523C(07/00)
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