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IXFK80N20Q PDF预览

IXFK80N20Q

更新时间: 2024-09-26 22:47:47
品牌 Logo 应用领域
IXYS /
页数 文件大小 规格书
2页 73K
描述
HiPerFET Power MOSFETs Q-Class

IXFK80N20Q 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TO-264
包装说明:TO-264, 3 PIN针数:3
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.75其他特性:AVALANCHE RATED
雪崩能效等级(Eas):1500 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:200 V
最大漏极电流 (Abs) (ID):80 A最大漏极电流 (ID):80 A
最大漏源导通电阻:0.028 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-264JESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):360 W
最大脉冲漏极电流 (IDM):320 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IXFK80N20Q 数据手册

 浏览型号IXFK80N20Q的Datasheet PDF文件第2页 
HiPerFETTM  
Power MOSFETs  
Q-Class  
IXFH 80N20Q  
IXFK 80N20Q  
IXFT 80N20Q  
VDSS = 200 V  
ID25 = 80 A  
RDS(on) = 28 mW  
trr  
£ 200 ns  
N-Channel Enhancement Mode  
Avalanche Rated, High dv/dt, Low Qg  
Preliminary data sheet  
Symbol  
TestConditions  
Maximum Ratings  
TO-247AD(IXFH)  
VDSS  
VDGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGS = 1 MW  
200  
200  
V
V
(TAB)  
VGS  
VGSM  
Continuous  
Transient  
±20  
±30  
V
V
ID25  
IDM  
IAR  
TC = 25°C  
TC = 25°C, pulse width limited by TJM  
TC = 25°C  
80  
320  
80  
A
A
A
TO-268 (D3) ( IXFT)  
G
EAR  
EAS  
TC = 25°C  
TC = 25°C  
45  
1.5  
mJ  
J
(TAB)  
S
dv/dt  
IS £ IDM, di/dt £ 100 A/ms, VDD £ VDSS  
TJ £ 150°C, RG = 2 W  
,
5
V/ns  
TO-264AA(IXFK)  
PD  
TC = 25°C  
360  
W
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
G
D
S
D (TAB)  
TL  
1.6 mm (0.063 in) from case for 10 s  
300  
°C  
G = Gate  
S = Source  
TAB = Drain  
Md  
Mountingtorque  
TO-247  
TO-264  
1.13/10 Nm/lb.in.  
0.9/6 Nm/lb.in.  
Weight  
Symbol  
TO-247  
TO-264  
TO-268  
6
10  
4
g
g
g
Features  
• Low gate charge  
TestConditions  
CharacteristicValues  
• Internationalstandardpackages  
• EpoxymeetUL94V-0,flammability  
classification  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
• Low RDS (on) HDMOSTM process  
• Rugged polysilicon gate cell structure  
• Avalanche energy and current rated  
• Fast intrinsic Rectifier  
VDSS  
VGS = 0 V, ID = 250 uA  
VDS = VGS, ID = 4 mA  
200  
2.0  
V
V
VGS(th)  
4.0  
IGSS  
IDSS  
VGS = ±20 VDC, VDS = 0  
±100 nA  
25 mA  
Advantages  
VDS = VDSS  
VGS = 0 V  
TJ = 25°C  
TJ = 125°C  
1
mA  
• Easy to mount  
• Space savings  
• High power density  
RDS(on)  
VGS = 10 V, ID = 0.5 • ID25  
Pulse test, t £ 300 ms, duty cycle d £ 2 %  
28 mW  
IXYS reserves the right to change limits, test conditions, and dimensions.  
© 2000 IXYS All rights reserved  
98605A (6/99)  
1 - 2  

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