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IXFK73N30 PDF预览

IXFK73N30

更新时间: 2024-11-21 14:56:15
品牌 Logo 应用领域
力特 - LITTELFUSE /
页数 文件大小 规格书
5页 210K
描述
功能与特色: 应用: 优点:

IXFK73N30 技术参数

是否Rohs认证: 符合生命周期:Not Recommended
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:compliant
风险等级:5.32其他特性:AVALANCHE RATED
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:300 V最大漏极电流 (Abs) (ID):73 A
最大漏极电流 (ID):73 A最大漏源导通电阻:0.045 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-264
JESD-30 代码:R-PSFM-T3JESD-609代码:e1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL功耗环境最大值:500 W
最大功率耗散 (Abs):500 W最大脉冲漏极电流 (IDM):292 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IXFK73N30 数据手册

 浏览型号IXFK73N30的Datasheet PDF文件第2页浏览型号IXFK73N30的Datasheet PDF文件第3页浏览型号IXFK73N30的Datasheet PDF文件第4页浏览型号IXFK73N30的Datasheet PDF文件第5页 
HiPerFETTM  
Power MOSFETs  
V
I
R
DSS  
D25  
DS(on)  
IXFK 73 N 30 300 V  
IXFN 73 N 30 300 V  
73 A  
73 A  
45 m  
45 mΩ  
t 200 ns  
rr  
N-Channel Enhancement Mode  
Avalanche Rated, High dv/dt, Low trr  
TO-264 AA (IXFK)  
Symbol  
TestConditions  
Maximum Ratings  
IXFK  
IXFN  
VDSS  
VDGR  
TJ = 25°C to 150°C  
300  
300  
300  
300  
V
V
TJ = 25°C to 150°C; RGS = 1 MΩ  
(TAB)  
G
D
S
VGS  
Continuous  
Transient  
20  
30  
20  
30  
V
V
VGSM  
miniBLOC, SOT-227 B (IXFN)  
E153432  
ID25  
IDM  
IAR  
TC = 25°C  
73  
292  
40  
73  
292  
40  
A
A
A
S
TC = 25°C, pulse width limited by TJM  
TC = 25°C  
G
EAR  
TC = 25°C  
30  
5
30  
5
mJ  
S
dv/dt  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 2 W  
,
V/ns  
D
PD  
TC = 25°C  
500  
520  
W
G = Gate  
S = Source  
D=Drain  
TAB = Drain  
TJ  
-55 ... +150  
150  
-55 ... +150  
300  
°C  
°C  
°C  
Either Source terminal at miniBLOC can be used  
asMainorKelvinSource  
TJM  
Tstg  
Features  
Internationalstandardpackages  
l
TL  
1.6 mm (0.063 in) from case for 10 s  
50/60 Hz, RMS t = 1 min  
-
°C  
l
JEDEC TO-264 AA, epoxy meet  
UL94V-0,flammabilityclassification  
VISOL  
-
-
2500  
3000  
V~  
V~  
IISOL 1 mA  
t = 1 s  
l
miniBLOCwithAluminiumnitride  
isolation  
Low RDS (on) HDMOSTM process  
Ruggedpolysilicongatecellstructure  
Md  
Mountingtorque  
Terminalconnectiontorque  
0.9/6  
-
1.5/13 Nm/lb.in.  
1.5/13 Nm/lb.in.  
l
l
l
Weight  
10  
30  
g
UnclampedInductiveSwitching(UIS)  
rated  
l
Lowpackageinductance  
FastintrinsicRectifier  
l
Applications  
DC-DC converters  
Symbol  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
l
l
Synchronousrectification  
Batterychargers  
l
l
Switched-modeandresonant-mode  
power supplies  
DC choppers  
Temperatureandlightingcontrols  
Low voltage relays  
VDSS  
VGS = 0 V, ID = 1 mA  
VDS = VGS, ID = 8 mA  
300  
2
V
V
VGS(th)  
4
l
l
IGSS  
IDSS  
VGS = 20 VDC, VDS = 0  
200 nA  
400 uA  
l
VDS = 0.8 VDSS  
VGS = 0 V  
TJ = 25°C  
TJ = 125°C  
2
mA  
Advantages  
Easy to mount  
Space savings  
High power density  
l
RDS(on)  
VGS = 10 V, ID = 0.5 ID25  
Pulse test, t 300 µs, duty cycle d 2 %  
45 mΩ  
l
l
© 2001 IXYS All rights reserved  
92805J (11/01)  

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