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ISL9N322AP3_NL

更新时间: 2024-11-25 13:08:55
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飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关局域网
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ISL9N322AP3_NL 数据手册

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January 2002  
ISL9N322AP3/ISL9N322AS3ST  
N-Channel Logic Level PWM Optimized UltraFET® Trench Power MOSFETs  
General Description  
Features  
This device employs a new advanced trench MOSFET  
technology and features low gate charge while maintaining  
low on-resistance.  
• Fast switching  
• r  
• r  
= 0.018(Typ), V = 10V  
GS  
DS(ON)  
DS(ON)  
= 0.028(Typ), V = 4.5V  
Optimized for switching applications, this device improves  
the overall efficiency of DC/DC converters and allows  
operation to higher switching frequencies.  
GS  
• Q (Typ) = 9nC, V = 5V  
g
GS  
• Q (Typ) = 3nC  
gd  
Applications  
• DC/DC converters  
• C  
(Typ) = 970pF  
ISS  
SOURCE  
DRAIN  
GATE  
DRAIN  
(FLANGE)  
D
S
GATE  
SOURCE  
G
DRAIN  
(FLANGE)  
TO-263AB  
TO-220AB  
MOSFET Maximum Ratings T = 25°C unless otherwise noted  
A
Symbol  
Parameter  
Ratings  
30  
Units  
V
V
V
V
Drain to Source Voltage  
Gate to Source Voltage  
DSS  
GS  
20  
Drain Current  
o
35  
20  
A
A
Continuous (T = 25 C, V = 10V)  
C
GS  
o
I
Continuous (T = 100 C, V = 4.5V)  
C GS  
D
o
o
Continuous (T = 25 C, V = 10V, R = 43 C/W)  
θJA  
9
A
C
GS  
Pulsed  
Figure 4  
A
Power dissipation  
Derate above 25 C  
50  
0.33  
W
W/ C  
P
o
o
D
o
T , T  
Operating and Storage Temperature  
-55 to 175  
C
J
STG  
Thermal Characteristics  
o
o
o
R
R
R
Thermal Resistance Junction to Case TO-220, TO-263  
3
C/W  
C/W  
C/W  
θJC  
θJA  
θJA  
Thermal Resistance Junction to Ambient TO-220, TO-263  
62  
43  
2
Thermal Resistance Junction to Ambient TO-263, 1in copper pad area  
Package Marking and Ordering Information  
Device Marking  
N322AS  
Device  
ISL9N322AS3ST  
ISL9N322AP3  
Package  
TO-263AB  
TO-220AB  
Reel Size  
330mm  
Tube  
Tape Width  
24mm  
N/A  
Quantity  
800 units  
50 units  
N322AP  
©2002 Fairchild Semiconductor Corporation  
Rev. B, January 2002  

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