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ISL9N7030BLP3 PDF预览

ISL9N7030BLP3

更新时间: 2024-11-24 22:26:11
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
10页 198K
描述
30V, 0.009 Ohm, 75A, N-Channel Logic Level UltraFET Trench Power MOSFETs

ISL9N7030BLP3 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.34
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):15 A
最大漏极电流 (ID):75 A最大漏源导通电阻:0.012 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):100 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Matte Tin (Sn)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

ISL9N7030BLP3 数据手册

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ISL9N7030BLP3, ISL9N7030BLS3ST  
Data Sheet  
January2002  
30V, 0.009 Ohm, 75A, N-Channel Logic  
Level UltraFET® Trench Power MOSFETs  
PWM  
Optimized  
This device employs a new advanced trench MOSFET  
technology and features low gate charge while maintaining  
low on-resistance.  
Features  
Optimized for switching applications, this device improves  
the overall efficiency of DC/DC converters and allows  
operation to higher switching frequencies.  
• Fast Switching  
• r  
• r  
= 0.0064Ω (Typ), VGS = 10V  
= 0.010Ω (Typ), VGS = 4.5V  
DS(ON)  
DS(ON)  
• Q Total 24nC (Typ), VGS = 5V  
g
Packaging  
• Q (Typ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11nC  
gd  
ISL9N7030BLS3ST  
JEDEC TO-263AB  
ISL9N7030BLP3  
JEDEC TO-220AB  
• C  
ISS  
(Typ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2600pF  
Symbol  
SOURCE  
DRAIN  
GATE  
DRAIN  
(FLANGE)  
D
G
GATE  
SOURCE  
DRAIN  
(FLANGE)  
S
Ordering Information  
PART NUMBER  
PACKAGE  
TO-220AB  
TO-263AB (Tape and Reel)  
BRAND  
7030BL  
7030BL  
ISL9N7030BLP3  
ISL9N7030BLS3ST  
o
Absolute Maximum Ratings  
T
= 25 C, Unless Otherwise Specified  
C
SYMBOL  
PARAMETER  
ISL9N7030BLP3, ISL9N7030BLS3ST  
UNITS  
V
Drain to Source Voltage (Note 1)  
30  
30  
V
V
V
DSS  
V
Drain to Gate Voltage (R = 20k) (Note 1)  
GS  
DGR  
V
Gate to Source Voltage  
±20  
GS  
Drain Current  
o
I
I
I
Continuous (T = 25 C, V  
= 10V) (Figure 2)  
GS  
75  
48  
15  
A
A
A
A
D
D
D
C
o
Continuous (T = 100 C, V  
= 4.5V) (Figure 2)  
C
GS  
= 10V, R  
o
o
Continuous (T = 25 C, V  
= 43 C/W)  
θJA  
C
GS  
I
Pulsed Drain Current  
Power Dissipation  
Figure 4  
DM  
P
100  
0.67  
W
D
o
o
Derate Above 25 C  
W/ C  
o
T , T  
Operating and Storage Temperature  
-55 to 175  
C
J
STG  
Maximum Temperature for Soldering  
Leads at 0.063in (1.6mm) from Case for 10s  
Package Body for 10s, See Techbrief TB334  
o
T
300  
260  
C
L
o
T
C
pkg  
THERMAL SPECIFICATIONS  
o
R
R
R
Thermal Resistance Junction to Case, TO-220, TO-263  
1.5  
62  
43  
C/W  
θJC  
θJA  
θJA  
o
Thermal Resistance Junction to Ambient, TO-220, TO-263  
C/W  
2
o
Thermal Resistance Junction to Ambient, TO-263, 1in copper pad area  
C/W  
NOTE:  
o
o
1. T = 25 C to 150 C.  
J
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
Product reliability information can be found at http://www.fairchildsemi.com/products/discrete/reliability/index.html  
For severe environments, see our Automotive products.  
All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.  
©2002 Fairchild Semiconductor Corporation  
ISL9N7030BLP3, ISL9N7030BLS3ST Rev. B  

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