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ISL9N312AS3ST PDF预览

ISL9N312AS3ST

更新时间: 2024-11-09 22:31:35
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关
页数 文件大小 规格书
11页 142K
描述
N-Channel Logic Level PWM Optimized UltraFET Trench Power MOSFETs

ISL9N312AS3ST 技术参数

是否Rohs认证: 符合生命周期:Obsolete
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.64
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):58 A
最大漏极电流 (ID):58 A最大漏源导通电阻:0.012 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):75 W认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

ISL9N312AS3ST 数据手册

 浏览型号ISL9N312AS3ST的Datasheet PDF文件第2页浏览型号ISL9N312AS3ST的Datasheet PDF文件第3页浏览型号ISL9N312AS3ST的Datasheet PDF文件第4页浏览型号ISL9N312AS3ST的Datasheet PDF文件第5页浏览型号ISL9N312AS3ST的Datasheet PDF文件第6页浏览型号ISL9N312AS3ST的Datasheet PDF文件第7页 
January 2002  
ISL9N312AP3/ISL9N312AS3ST  
N-Channel Logic Level PWM Optimized UltraFET® Trench Power MOSFETs  
General Description  
Features  
This device employs a new advanced trench MOSFET  
technology and features low gate charge while maintaining  
low on-resistance.  
• Fast switching  
• r  
• r  
= 0.010(Typ), V = 10V  
GS  
DS(ON)  
DS(ON)  
= 0.017(Typ), V = 4.5V  
Optimized for switching applications, this device improves  
the overall efficiency of DC/DC converters and allows  
operation to higher switching frequencies.  
GS  
• Q (Typ) = 13nC, V = 5V  
g
GS  
• Q (Typ) = 4.5nC  
gd  
Applications  
• DC/DC converters  
• C  
(Typ) = 1450pF  
ISS  
SOURCE  
DRAIN  
GATE  
DRAIN  
(FLANGE)  
D
S
G
GATE  
SOURCE  
DRAIN  
(FLANGE)  
TO-263AB  
TO-220AB  
MOSFET Maximum Ratings T = 25°C unless otherwise noted  
A
Symbol  
Parameter  
Ratings  
30  
Units  
V
V
V
V
Drain to Source Voltage  
Gate to Source Voltage  
DSS  
GS  
20  
Drain Current  
o
58  
32  
A
A
Continuous (T = 25 C, V = 10V)  
C
GS  
o
I
Continuous (T = 100 C, V = 4.5V)  
C GS  
D
o
o
Continuous (T = 25 C, V = 10V, R = 43 C/W)  
θJA  
12  
A
C
GS  
Pulsed  
Figure 4  
A
Power dissipation  
Derate above 25 C  
75  
0.5  
W
W/ C  
P
o
o
D
o
T , T  
Operating and Storage Temperature  
-55 to 175  
C
J
STG  
Thermal Characteristics  
o
R
R
R
Thermal Resistance Junction to Case TO-220, TO-263  
2
C/W  
θJC  
θJA  
θJA  
o
Thermal Resistance Junction to Ambient TO-220, TO-263  
62  
43  
C/W  
2
o
Thermal Resistance Junction to Ambient TO-263, 1in copper pad area  
C/W  
Package Marking and Ordering Information  
Device Marking  
N312AS  
Device  
ISL9N312AS3ST  
ISL9N312AP3  
Package  
TO-263AB  
TO-220AB  
Reel Size  
330mm  
Tube  
Tape Width  
24mm  
N/A  
Quantity  
800 units  
50  
N312AP  
©2002 Fairchild Semiconductor Corporation  
Rev. B, January 2002  

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