IS61WV12816DALL/DALS
IS61WV12816DBLL/DBLS
IS64WV12816DBLL/DBLS
128K x 16 HIGH SPEED ASYNCHRONOUS
CMOS STATIC RAM
JANUARY 2013
DESCRIPTION
FEATURES
TheꢀISSIꢀIS61WV12816DAxx/DBxxꢀandꢀIS64WV12816D-
Bxxꢀareꢀhigh-speed,ꢀ2,097,152-bitꢀstaticꢀRAMsꢀorganizedꢀ
asꢀ131,072ꢀwordsꢀbyꢀ16ꢀbits.ꢀItꢀisꢀfabricatedꢀusingꢀISSI's
high-performanceꢀCMOSꢀtechnology.ꢀThisꢀhighlyꢀreliableꢀ
process coupled with innovative circuit design techniques,
yields high-performance and low power consumption
devices.
HIGH SPEED: (IS61/64WV12816DALL/DBLL)
•ꢀ High-speedꢀaccessꢀtime:ꢀ8,ꢀ10,ꢀ12,ꢀ20ꢀns
•ꢀ LowꢀActiveꢀPower:ꢀ135ꢀmWꢀ(typical)
•ꢀ LowꢀStandbyꢀPower:ꢀ12ꢀµWꢀ(typical)
CMOS standby
LOW POWER: (IS61/64WV12816DALS/DBLS)
•ꢀ High-speedꢀaccessꢀtime:ꢀ25,ꢀ35ꢀns
•ꢀ LowꢀActiveꢀPower:ꢀ55ꢀmWꢀ(typical)
When CE is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be re-
duced down with CMOS input levels.
•ꢀ LowꢀStandbyꢀPower:ꢀ12ꢀµWꢀ(typical)
CMOS standby
EasyꢀmemoryꢀexpansionꢀisꢀprovidedꢀbyꢀusingꢀChipꢀEnableꢀ
andꢀOutputꢀEnableꢀinputs,ꢀCEꢀandꢀOE.ꢀTheꢀactiveꢀLOWꢀ
Write Enable (WE) controls both writing and reading of the
memory. A data byte allows Upper Byte (UB) and Lower
Byte (LB) access.
•ꢀ Singleꢀpowerꢀsupply
— Vddꢀ1.65Vꢀtoꢀ2.2Vꢀ(IS61WV12816DAxx)
— Vddꢀ2.4Vꢀtoꢀ3.6Vꢀ(IS61/64WV12816DBxx)
•ꢀ Fullyꢀstaticꢀoperation:ꢀnoꢀclockꢀorꢀrefreshꢀ
Theꢀ IS61WV12816DAxx/DBxxꢀ andꢀ IS64WV12816DBxxꢀ
areꢀꢀpackagedꢀinꢀtheꢀJEDECꢀstandardꢀ44-pinꢀTSOPꢀTypeꢀ
IIꢀꢀandꢀ48-pinꢀMiniꢀBGAꢀ(6mmꢀxꢀ8mm).
required
•ꢀ Threeꢀstateꢀoutputs
•ꢀ Dataꢀcontrolꢀforꢀupperꢀandꢀlowerꢀbytes
•ꢀ IndustrialꢀandꢀAutomotiveꢀtemperatureꢀsupport
•ꢀ Lead-freeꢀavailable
FUNCTIONAL BLOCK DIAGRAM
128K x 16
MEMORY ARRAY
A0-A16
DECODER
VDD
GND
I/O0-I/O7
Lower Byte
I/O
DATA
COLUMN I/O
CIRCUIT
I/O8-I/O15
Upper Byte
CE
OE
WE
CONTROL
CIRCUIT
UB
LB
Copyright © 2013 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time with-
out notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain
the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com
1
Rev. E
01/10/2013