IS61WV12816DALL/DALS
IS61WV12816DBLL/DBLS
IS64WV12816DBLL/DBLS
128K x 16 HIGH SPEED ASYNCHRONOUS
CMOS STATIC RAM
MAY2008
DESCRIPTION
FEATURES
TheISSIIS61WV12816DAxx/DBxxandIS64WV12816DBxx
are high-speed, 2,097,152-bit static RAMs organized as
131,072 words by 16 bits. It is fabricated usingISSI's high-
performance CMOS technology. This highly reliable pro-
cess coupled with innovative circuit design techniques,
yields high-performance and low power consumption de-
vices.
HIGH SPEED: (IS61/64WV12816DALL/DBLL)
• High-speed access time: 8, 10, 12, 20 ns
• Low Active Power: 135 mW (typical)
• Low Standby Power: 12 μW (typical)
CMOS standby
LOW POWER: (IS61/64WV12816DALS/DBLS)
• High-speed access time: 25, 35 ns
• Low Active Power: 55 mW (typical)
When CE is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be
reduced down with CMOS input levels.
• Low Standby Power: 12 μW (typical)
CMOS standby
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs, CE and OE. The active LOW
Write Enable (WE) controls both writing and reading of the
memory. A data byte allows Upper Byte (UB) and Lower
Byte (LB) access.
• Single power supply
— VDD 1.65V to 2.2V (IS61WV12816DAxx)
— VDD 2.4V to 3.6V (IS61/64WV12816DBxx)
• Fully static operation: no clock or refresh
required
TheIS61WV12816DAxx/DBxxandIS64WV12816DBxxare
packagedintheJEDECstandard44-pinTSOPTypeII and
48-pin Mini BGA (6mm x 8mm).
• Three state outputs
• Data control for upper and lower bytes
• Industrial and Automotive temperature support
• Lead-free available
FUNCTIONAL BLOCK DIAGRAM
128K x 16
MEMORY ARRAY
A0-A16
DECODER
VDD
GND
I/O0-I/O7
Lower Byte
I/O
DATA
COLUMN I/O
CIRCUIT
I/O8-I/O15
Upper Byte
CE
OE
WE
CONTROL
CIRCUIT
UB
LB
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com
1
Rev. C
05/01/08