是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | TBGA, BGA144,12X18,40/32 |
针数: | 144 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.32 |
风险等级: | 5.65 | 访问模式: | MULTI BANK PAGE BURST |
最长访问时间: | 3.3 ns | 其他特性: | AUTO REFRESH |
最大时钟频率 (fCLK): | 300 MHz | I/O 类型: | COMMON |
JESD-30 代码: | R-PBGA-B144 | 长度: | 18.5 mm |
内存密度: | 603979776 bit | 内存集成电路类型: | DDR DRAM |
内存宽度: | 36 | 功能数量: | 1 |
端口数量: | 1 | 端子数量: | 144 |
字数: | 16777216 words | 字数代码: | 16000000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 16MX36 |
输出特性: | 3-STATE | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TBGA | 封装等效代码: | BGA144,12X18,40/32 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, THIN PROFILE |
电源: | 1.5/1.8,1.8,2.5 V | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 连续突发长度: | 2,4,8 |
最大待机电流: | 0.048 A | 子类别: | DRAMs |
最大压摆率: | 0.914 mA | 最大供电电压 (Vsup): | 1.9 V |
最小供电电压 (Vsup): | 1.7 V | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
宽度: | 11 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
IS49NLC36160-33WBL | ISSI |
获取价格 |
DDR DRAM, 16MX36, CMOS, PBGA144, WBGA-144 | |
IS49NLC36160-5WBLI | ISSI |
获取价格 |
DDR DRAM, 16MX36, CMOS, PBGA144, WBGA-144 | |
IS49NLC36160A | ISSI |
获取价格 |
Reduced cycle time | |
IS49NLC36160A-18BLI | ISSI |
获取价格 |
DDR DRAM, 16MX36, CMOS, PBGA144, FBGA-144 | |
IS49NLC36160A-18WBLI | ISSI |
获取价格 |
DDR DRAM, 16MX36, CMOS, PBGA144, WBGA-144 | |
IS49NLC36160A-25BI | ISSI |
获取价格 |
DDR DRAM, 16MX36, CMOS, PBGA144, FBGA-144 | |
IS49NLC36160A-25BL | ISSI |
获取价格 |
DDR DRAM, 16MX36, CMOS, PBGA144, FBGA-144 | |
IS49NLC36160A-25EB | ISSI |
获取价格 |
DDR DRAM, 16MX36, CMOS, PBGA144, FBGA-144 | |
IS49NLC36160A-25EBL | ISSI |
获取价格 |
DDR DRAM, 16MX36, CMOS, PBGA144, FBGA-144 | |
IS49NLC36160A-25EWBL | ISSI |
获取价格 |
DDR DRAM, 16MX36, CMOS, PBGA144, WBGA-144 |