是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | TBGA, | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | Factory Lead Time: | 10 weeks |
风险等级: | 5.67 | 访问模式: | MULTI BANK PAGE BURST |
其他特性: | AUTO REFRESH | JESD-30 代码: | R-PBGA-B144 |
JESD-609代码: | e1 | 长度: | 18.5 mm |
内存密度: | 603979776 bit | 内存集成电路类型: | DDR DRAM |
内存宽度: | 36 | 功能数量: | 1 |
端口数量: | 1 | 端子数量: | 144 |
字数: | 16777216 words | 字数代码: | 16000000 |
工作模式: | SYNCHRONOUS | 组织: | 16MX36 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, THIN PROFILE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 座面最大高度: | 1.2 mm |
最大供电电压 (Vsup): | 1.9 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 11 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
IS49NLC36800 | ISSI |
获取价格 |
288Mb (x9, x18, x36) Common I/O RLDRAM 2 Memory | |
IS49NLC36800-25BL | ISSI |
获取价格 |
DDR DRAM, 8MX36, 2.5ns, CMOS, PBGA144, 11 X 18.50 MM, LEAD FREE, FBGA-144 | |
IS49NLC36800-25EBL | ISSI |
获取价格 |
DDR DRAM, 8MX36, 2.5ns, CMOS, PBGA144, 11 X 18.50 MM, LEAD FREE, FBGA-144 | |
IS49NLC36800-25EBLI | ISSI |
获取价格 |
暂无描述 | |
IS49NLC36800-25EWBL | ISSI |
获取价格 |
DDR DRAM, 8MX36, CMOS, PBGA144, WBGA-144 | |
IS49NLC36800-25EWBLI | ISSI |
获取价格 |
DDR DRAM, 8MX36, CMOS, PBGA144, WBGA-144 | |
IS49NLC36800-25WBL | ISSI |
获取价格 |
DDR DRAM, 8MX36, CMOS, PBGA144, WBGA-144 | |
IS49NLC36800-33BL | ISSI |
获取价格 |
DDR DRAM, 8MX36, 3.3ns, CMOS, PBGA144, 11 X 18.50 MM, LEAD FREE, FBGA-144 | |
IS49NLC36800-33WBLI | ISSI |
获取价格 |
DDR DRAM, 8MX36, CMOS, PBGA144, WBGA-144 | |
IS49NLC36800-5WBL | ISSI |
获取价格 |
DDR DRAM, 8MX36, CMOS, PBGA144, WBGA-144 |