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IS41C44054-50TI PDF预览

IS41C44054-50TI

更新时间: 2024-01-27 12:44:34
品牌 Logo 应用领域
美国芯成 - ISSI 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
17页 137K
描述
Fast Page DRAM, 4MX4, 50ns, CMOS, PDSO24, TSOP2-26/24

IS41C44054-50TI 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP2包装说明:TSOP2, TSOP24/26,.46
针数:26Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8542.32.00.02
风险等级:5.35Is Samacsys:N
访问模式:FAST PAGE最长访问时间:50 ns
其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESHI/O 类型:COMMON
JESD-30 代码:R-PDSO-G24JESD-609代码:e0
长度:17.14 mm内存密度:16777216 bit
内存集成电路类型:FAST PAGE DRAM内存宽度:4
功能数量:1端口数量:1
端子数量:24字数:4194304 words
字数代码:4000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:4MX4输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSOP2
封装等效代码:TSOP24/26,.46封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE峰值回流温度(摄氏度):NOT SPECIFIED
电源:5 V认证状态:Not Qualified
刷新周期:4096座面最大高度:1.2 mm
自我刷新:NO最大待机电流:0.001 A
子类别:DRAMs最大压摆率:0.12 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:7.62 mm
Base Number Matches:1

IS41C44054-50TI 数据手册

 浏览型号IS41C44054-50TI的Datasheet PDF文件第2页浏览型号IS41C44054-50TI的Datasheet PDF文件第3页浏览型号IS41C44054-50TI的Datasheet PDF文件第4页浏览型号IS41C44054-50TI的Datasheet PDF文件第6页浏览型号IS41C44054-50TI的Datasheet PDF文件第7页浏览型号IS41C44054-50TI的Datasheet PDF文件第8页 
IS41C4405X  
®
IS41LV4405X SERIES  
ISSI  
ELECTRICALCHARACTERISTICS(1)  
(Recommended Operating Conditions unless otherwise noted.)  
Symbol Parameter  
Test Condition  
VCC  
Speed Min. Max. Unit  
IIL  
Input Leakage Current  
Any input 0V VIN Vcc  
5  
5  
2.4  
5
µA  
µA  
V
Other inputs not under test = 0V  
IIO  
Output Leakage Current  
OutputHighVoltageLevel  
OutputLowVoltageLevel  
Standby Current: TTL  
Output is disabled (Hi-Z)  
0V VOUT Vcc  
5
VOH  
VOL  
ICC1  
IOH = 5.0 mA, Vcc = 5V  
IOH = 2.0 mA, Vcc = 3.3V  
0.4  
IOL = 4.2 mA, Vcc = 5V  
IOL = 2 mA, Vcc = 3.3V  
V
RAS, CAS VIH Commercial  
5V  
3.3V  
5V  
2
0.5  
3
mA  
Industrial  
3.3V  
2
ICC2  
ICC3  
Standby Current: CMOS  
RAS, CAS VCC 0.2V  
5V  
3.3V  
0.5  
1
mA  
mA  
Operating Current:  
RAS, CAS,  
Address Cycling, tRC = tRC (min.)  
-50  
-60  
120  
110  
Random Read/Write(2,3)  
AveragePowerSupplyCurrent  
ICC4  
ICC4  
Operating Current:  
RAS= VIL, CAS VIH  
-50  
-60  
90  
80  
mA  
mA  
mA  
Fast Page Mode(2,3,4)  
AveragePowerSupplyCurrent  
tRC = tRC (min.)  
Refresh Current:  
RAS Cycling, CAS VIH  
tRC = tRC (min.)  
-50  
-60  
120  
110  
RAS-Only(2,3)  
AveragePowerSupplyCurrent  
ICC5  
Refresh Current:  
CBR(2,3,5)  
RAS, CAS Cycling  
tRC = tRC (min.)  
-50  
-60  
120  
110  
AveragePowerSupplyCurrent  
Notes:  
1. An initial pause of 200 µs is required after power-up followed by eight RAS refresh cycles (RAS-Only or CBR) before proper device  
operation is assured. The eight RAS cycles wake-up should be repeated any time the tREF refresh requirement is exceeded.  
2. Dependent on cycle rates.  
3. Specified values are obtained with minimum cycle time and the output open.  
4. Column-address is changed once each Fast Page cycle.  
5. Enables on-chip refresh and address counters.  
Integrated Silicon Solution, Inc. 1-800-379-4774  
5
Rev. B  
01/31/01  

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