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IS41C44054-50TI PDF预览

IS41C44054-50TI

更新时间: 2024-01-04 19:42:22
品牌 Logo 应用领域
美国芯成 - ISSI 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
17页 137K
描述
Fast Page DRAM, 4MX4, 50ns, CMOS, PDSO24, TSOP2-26/24

IS41C44054-50TI 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP2包装说明:TSOP2, TSOP24/26,.46
针数:26Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8542.32.00.02
风险等级:5.35Is Samacsys:N
访问模式:FAST PAGE最长访问时间:50 ns
其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESHI/O 类型:COMMON
JESD-30 代码:R-PDSO-G24JESD-609代码:e0
长度:17.14 mm内存密度:16777216 bit
内存集成电路类型:FAST PAGE DRAM内存宽度:4
功能数量:1端口数量:1
端子数量:24字数:4194304 words
字数代码:4000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:4MX4输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSOP2
封装等效代码:TSOP24/26,.46封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE峰值回流温度(摄氏度):NOT SPECIFIED
电源:5 V认证状态:Not Qualified
刷新周期:4096座面最大高度:1.2 mm
自我刷新:NO最大待机电流:0.001 A
子类别:DRAMs最大压摆率:0.12 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:7.62 mm
Base Number Matches:1

IS41C44054-50TI 数据手册

 浏览型号IS41C44054-50TI的Datasheet PDF文件第1页浏览型号IS41C44054-50TI的Datasheet PDF文件第2页浏览型号IS41C44054-50TI的Datasheet PDF文件第4页浏览型号IS41C44054-50TI的Datasheet PDF文件第5页浏览型号IS41C44054-50TI的Datasheet PDF文件第6页浏览型号IS41C44054-50TI的Datasheet PDF文件第7页 
IS41C4405X  
®
IS41LV4405X SERIES  
ISSI  
Functional Description  
Auto Refresh Cycle  
The IS41C4405x and IS41LV4405x are CMOS DRAMs  
optimizedforhigh-speedbandwidth,lowpowerapplications.  
During READ or WRITE cycles, each bit is uniquely  
addressed through the 11 or 12 address bits. These are  
entered 11 bits (A0-A10) at a time for the 2K refresh  
device or 12 bits (A0-A11) at a time for the 4K refresh  
device. The row address is latched by the Row Address  
Strobe (RAS). The column address is latched by the  
Column Address Strobe (CAS). RAS is used to latch the  
first nine bits and CAS is used the latter ten bits.  
To retain data, 2,048 refresh cycles are required in each  
32 ms period, or 4,096 refresh cycles are required in each  
64ms period. There are two ways to refresh the memory:  
1. By clocking each of the 2,048 row addresses (A0  
throughA10)or4096rowaddresses(A0throughA11)with  
RAS at least once every 32 ms or 64ms respectively.  
Any read, write, read-modify-write or RAS-only cycle  
refreshes the addressed row.  
2. Using a CAS-before-RAS refresh cycle. CAS-before-RAS  
refresh is activated by the falling edge of RAS, while  
holding CAS LOW. In CAS-before-RAS refresh cycle,  
an internal 9-bit counter provides the row addresses  
and the external address inputs are ignored.  
Memory Cycle  
A memory cycle is initiated by bring RAS LOW and it is  
terminated by returning both RAS and CAS HIGH. To  
ensures proper device operation and data integrity any  
memory cycle, once initiated, must not be ended or  
aborted before the minimum tRAS time has expired. A new  
cycle must not be initiated until the minimum precharge  
time tRP, tCP has elapsed.  
CAS-before-RAS is a refresh-only mode and no data  
access or device selection is allowed. Thus, the output  
remains in the High-Z state during the cycle.  
Power-On  
After application of the VCC supply, an initial pause of  
200 µs is required followed by a minimum of eight  
initialization cycles (any combination of cycles containing  
a RAS signal).  
Read Cycle  
A read cycle is initiated by the falling edge of CAS or OE,  
whichever occurs last, while holding WE HIGH. The  
column address must be held for a minimum time speci-  
fied by tAR. Data Out becomes valid only when tRAC, tAA,  
tCAC and tOEA are all satisfied. As a result, the access time  
is dependent on the timing relationships between these  
parameters.  
During power-on, it is recommended that RAS track with  
VCC or be held at a valid VIH to avoid current surges.  
Write Cycle  
A write cycle is initiated by the falling edge of CAS and  
WE, whichever occurs last. The input data must be valid  
at or before the falling edge of CAS or WE, whichever  
occurs last.  
Integrated Silicon Solution, Inc. 1-800-379-4774  
3
Rev. B  
01/31/01  

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