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IRLR024NPBF PDF预览

IRLR024NPBF

更新时间: 2024-11-24 21:53:35
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管
页数 文件大小 规格书
10页 305K
描述
HEXFET Power MOSFET

IRLR024NPBF 技术参数

是否Rohs认证:符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:not_compliant
ECCN代码:EAR99Factory Lead Time:20 weeks
风险等级:6.84Is Samacsys:N
Base Number Matches:1

IRLR024NPBF 数据手册

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PD- 95081A  
IRLR024NPbF  
IRLU024NPbF  
HEXFET® Power MOSFET  
l Logic-Level Gate Drive  
l Surface Mount (IRLR024N)  
l Straight Lead (IRLU024N)  
l Advanced Process Technology  
l Fast Switching  
D
VDSS = 55V  
R
DS(on) = 0.065Ω  
G
l Fully Avalanche Rated  
l Lead-Free  
ID = 17A  
S
Description  
Fifth Generation HEXFET® Power MOSFETs from International Rectifier  
utilize advanced processing techniques to achieve the lowest possible on-  
resistance per silicon area. This benefit, combined with the fast switching  
speed and ruggedized device design that HEXFET power MOSFETs are well  
known for, provides the designer with an extremely efficient device for use in  
a wide variety of applications.  
The D-PAK is designed for surface mounting using vapor phase, infrared, or  
wave soldering techniques. The straight lead version (IRFU series) is for  
through-hole mounting applications. Power dissipation levels up to 1.5 watts  
are possible in typical surface mount applications.  
D-Pak  
I-Pak  
IRLR024NPbF IRLU024NPbF  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
17  
12  
A
72  
PD @TC = 25°C  
PowerDissipation  
45  
W
W/°C  
V
LinearDeratingFactor  
0.3  
VGS  
EAS  
IAR  
Gate-to-SourceVoltage  
± 16  
Single Pulse Avalanche Energy‚  
AvalancheCurrent  
68  
mJ  
A
11  
4.5  
EAR  
dv/dt  
TJ  
RepetitiveAvalancheEnergy  
Peak Diode Recovery dv/dt ƒ  
OperatingJunctionand  
mJ  
V/ns  
5.0  
-55 to + 175  
TSTG  
StorageTemperatureRange  
SolderingTemperature, for10seconds  
°C  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
Max.  
3.3  
Units  
RθJC  
RθJA  
RθJA  
Case-to-Ambient(PCBmount)**  
Junction-to-Ambient  
–––  
50  
°C/W  
–––  
110  
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .  
For recommended footprint and soldering techniques refer to application note #AN-994  
www.irf.com  
1
12/6/04  

IRLR024NPBF 替代型号

型号 品牌 替代类型 描述 数据表
AUIRLR024NTRR INFINEON

完全替代

Advanced Planar Technology Low On-Resistance Fully Avalanche Rated
AUIRLR024NTRL INFINEON

完全替代

Advanced Planar Technology Low On-Resistance Fully Avalanche Rated
IRLR024NTRPBF INFINEON

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Advanced Process Technology

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