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IRHNJ93130 PDF预览

IRHNJ93130

更新时间: 2024-11-22 21:54:03
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 127K
描述
RADIATION HARDENED POWER MOSFET SURFACE MOUNT (SMD-0.5)

IRHNJ93130 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:CHIP CARRIER, R-CBCC-N3Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.32
雪崩能效等级(Eas):150 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):11 A最大漏极电流 (ID):11 A
最大漏源导通电阻:0.34 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-CBCC-N3JESD-609代码:e0
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:RECTANGULAR
封装形式:CHIP CARRIER峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):75 W
最大脉冲漏极电流 (IDM):44 A认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:NO LEAD
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON

IRHNJ93130 数据手册

 浏览型号IRHNJ93130的Datasheet PDF文件第2页浏览型号IRHNJ93130的Datasheet PDF文件第3页浏览型号IRHNJ93130的Datasheet PDF文件第4页浏览型号IRHNJ93130的Datasheet PDF文件第5页浏览型号IRHNJ93130的Datasheet PDF文件第6页浏览型号IRHNJ93130的Datasheet PDF文件第7页 
PD - 94277  
RADIATION HARDENED  
POWER MOSFET  
IRHNJ9130  
100V, P-CHANNEL  
SURFACE MOUNT (SMD-0.5) RAD HardHEXFET® TECHNOLOGY  
Product Summary  
Part Number Radiation Level RDS(on)  
ID  
IRHNJ9130  
100K Rads (Si) 0.29Ω  
300K Rads (Si) 0.29Ω  
-11A  
-11A  
IRHNJ93130  
International Rectifier’s RADHard HEXFET® technol-  
ogy provides high performance power MOSFETs for  
space applications. This technology has over a de-  
cade of proven performance and reliability in satellite  
applications. These devices have been character-  
ized for bothTotal Dose and Single Event Effects (SEE).  
The combination of low Rdson and low gate charge  
reduces the power losses in switching applications  
such as DC to DC converters and motor control. These  
devices retain all of the well established advantages  
of MOSFETs such as voltage control, fast switching,  
ease of paralleling and temperature stability of elec-  
trical parameters.  
SMD-0.5  
Features:  
n Single Event Effect (SEE) Hardened  
n Ultra Low RDS(on)  
n Low Total Gate Charge  
n Proton Tolerant  
n Simple Drive Requirements  
n Ease of Paralleling  
n Hermetically Sealed  
n Surface Mount  
n Ceramic Package  
n Light Weight  
Absolute Maximum Ratings  
Pre-Irradiation  
Parameter  
Units  
I
@ V  
@ V  
= -12V, T = 25°C Continuous Drain Current  
-11  
D
GS  
C
A
I
D
= -12V, T = 100°C Continuous Drain Current  
-7.0  
-44  
GS  
C
I
Pulsed Drain Current  
Max. Power Dissipation  
DM  
@ T = 25°C  
P
75  
W
W/°C  
V
D
C
Linear Derating Factor  
0.6  
V
Gate-to-Source Voltage  
±20  
GS  
E
Single Pulse Avalanche Energy ➀  
Avalanche Current ➀  
150  
mJ  
A
AS  
I
-11  
AR  
E
Repetitive Avalanche Energy ➀  
Peak Diode Recovery dv/dt ➀  
Operating Junction  
7.5  
mJ  
V/ns  
AR  
dv/dt  
-16  
T
-55 to 150  
J
T
Storage Temperature Range  
oC  
g
STG  
(for 5s)  
Package Mounting Surface Temp.  
Weight  
300  
1.0 (Typical)  
For footnotes refer to the last page  
www.irf.com  
1
7/12/01  

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