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IRHNJ9A3034

更新时间: 2024-11-24 11:01:15
品牌 Logo 应用领域
英飞凌 - INFINEON 开关脉冲晶体管
页数 文件大小 规格书
9页 389K
描述
Rad hard, 60V, 40A, single, N-channel MOSFET, R9 in a SMD-0.5 package - SMD-0.5, 300 krad TID, COTS

IRHNJ9A3034 技术参数

生命周期:Active包装说明:CHIP CARRIER, R-CBCC-N3
Reach Compliance Code:compliant风险等级:5.76
其他特性:HIGH RELIABILITY雪崩能效等级(Eas):840 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (Abs) (ID):40 A
最大漏极电流 (ID):40 A最大漏源导通电阻:0.018 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-CBCC-N3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:RECTANGULAR封装形式:CHIP CARRIER
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):75 W
最大脉冲漏极电流 (IDM):160 A参考标准:RH - 300K Rad(Si)
表面贴装:YES端子形式:NO LEAD
端子位置:BOTTOM晶体管应用:SWITCHING
晶体管元件材料:SILICON最大关闭时间(toff):75 ns
最大开启时间(吨):60 nsBase Number Matches:1

IRHNJ9A3034 数据手册

 浏览型号IRHNJ9A3034的Datasheet PDF文件第2页浏览型号IRHNJ9A3034的Datasheet PDF文件第3页浏览型号IRHNJ9A3034的Datasheet PDF文件第4页浏览型号IRHNJ9A3034的Datasheet PDF文件第5页浏览型号IRHNJ9A3034的Datasheet PDF文件第6页浏览型号IRHNJ9A3034的Datasheet PDF文件第7页 
PD-97845  
IRHNJ9A7034  
60V, N-CHANNEL  
RADIATION HARDENED  
POWER MOSFET  
SURFACE MOUNT (SMD-0.5)  
TECHNOLOGY  
R
9
Product Summary  
Part Number Radiation Level RDS(on)  
ID  
IRHNJ9A7034  
IRHNJ9A3034  
100 kRads (Si)  
300 kRads (Si)  
40A*  
40A*  
18m  
18m  
Description  
Features  
Low RDS(on)  
Fast Switching  
Single Event Effect (SEE) Hardened  
Low Total Gate Charge  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Electrically Isolated  
Ceramic package  
IR HiRel R9 technology provides superior power MOSFETs  
for space applications. These devices have improved  
immunity to Single Event Effect (SEE) and have been  
characterized for useful performance with Linear Energy  
Transfer (LET) up to 90MeV/(mg/cm2). Their combination of  
low RDS(on) and faster switching times reduces the power  
losses and increases power density in today’s high speed  
switching applications such as DC-DC converters and motor  
controllers. These devices retain all of the well established  
advantages of MOSFETs such as voltage control, fast  
switching, ease of paralleling and temperature stability of  
electrical parameters.  
Light Weight  
Surface Mount  
ESD Rating: Class 2 per MIL-STD-750,  
Method 1020  
Absolute Maximum Ratings  
Parameter  
Pre-Irradiation  
Units  
40*  
29  
ID @ VGS = 12V, TC = 25°C Continuous Drain Current  
ID @ VGS = 12V, TC = 100°C Continuous Drain Current  
A
160  
75  
IDM  
Pulsed Drain Current  
W
W/°C  
V
PD @TC = 25°C  
Maximum Power Dissipation  
0.6  
Linear Derating Factor  
± 20  
840  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy   
Avalanche Current   
mJ  
A
40  
7.5  
mJ  
V/ns  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy   
Peak Diode Recovery dv/dt   
Operating Junction and  
13  
-55 to + 150  
TSTG  
Storage Temperature Range  
Package Mounting Surface Temperature  
Weight  
°C  
g
300 (for 5s)  
1.0 (Typical)  
* Current is limited by package  
For Footnotes, refer to the page 2.  
1
2017-05-17  

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