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IRHNJ4130PBF PDF预览

IRHNJ4130PBF

更新时间: 2024-11-24 12:59:43
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英飞凌 - INFINEON /
页数 文件大小 规格书
8页 111K
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IRHNJ4130PBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:CHIP CARRIER, R-CBCC-N3Reach Compliance Code:compliant
风险等级:5.7雪崩能效等级(Eas):150 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:100 V最大漏极电流 (ID):14.4 A
最大漏源导通电阻:0.2 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-CBCC-N3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:RECTANGULAR封装形式:CHIP CARRIER
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):58 A表面贴装:YES
端子形式:NO LEAD端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRHNJ4130PBF 数据手册

 浏览型号IRHNJ4130PBF的Datasheet PDF文件第2页浏览型号IRHNJ4130PBF的Datasheet PDF文件第3页浏览型号IRHNJ4130PBF的Datasheet PDF文件第4页浏览型号IRHNJ4130PBF的Datasheet PDF文件第5页浏览型号IRHNJ4130PBF的Datasheet PDF文件第6页浏览型号IRHNJ4130PBF的Datasheet PDF文件第7页 
PD - 93820  
IRHNJ7130  
100V, N-CHANNEL  
RADIATION HARDENED  
POWER MOSFET  
SURFACE MOUNT (SMD-0.5)  
RAD-HardHEXFET®  
MOSFET TECHNOLOGY  
Product Summary  
Part Number Radiation Level RDS(on)  
ID  
IRHNJ7130 100K Rads (Si)  
IRHNJ3130 300K Rads (Si)  
IRHNJ4130 600K Rads (Si)  
0.1814.4A  
0.1814.4A  
0.1814.4A  
IRHNJ8130 1000K Rads (Si) 0.1814.4A  
SMD-0.5  
International Rectifier’s RAD-HardTM HEXFET® MOSFET  
technology provides high performance power MOSFETs  
for space applications. This technology has over a de-  
cade of proven performance and reliability in satellite  
applications. These devices have been characterized  
for both Total Dose and Single Event Effects (SEE). The  
combination of low RDS(on) and low gate charge reduces  
the power losses in switching applications such as DC  
to DC converters and motor control. These devices re-  
tain all of the well established advantages of MOSFETs  
such as voltage control, fast switching, ease of parallel-  
ing and temperature stability of electrical parameters.  
Features:  
n
n
n
n
n
n
n
n
n
n
Single Event Effect (SEE) Hardened  
Low RDS(on)  
Low Total Gate Charge  
Proton Tolerant  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Ceramic Package  
Surface Mount  
Light Weight  
Absolute Maximum Ratings  
Pre-Irradiation  
Parameter  
Units  
I
@ V  
@ V  
= 12V, T = 25°C  
Continuous Drain Current  
14.4  
D
GS  
C
A
I
= 12V, T = 100°C Continuous Drain Current  
9.1  
58  
D
GS  
C
I
Pulsed Drain Current ➀  
Max. Power Dissipation  
Linear Derating Factor  
DM  
@ T = 25°C  
P
75  
W
W/°C  
V
D
C
0.6  
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy  
Avalanche Current ➀  
±20  
GS  
E
150 ➁  
14.4  
mJ  
A
AS  
I
AR  
E
Repetitive Avalanche Energy ➀  
Peak Diode Recovery dv/dt  
Operating Junction  
7.5  
mJ  
V/ns  
AR  
dv/dt  
6.0 ➂  
-55 to 150  
T
J
T
Storage Temperature Range  
oC  
g
STG  
Pckg. Mounting Surface Temp.  
Weight  
300 (for 5s)  
1.0 (Typical)  
For footnotes refer to the last page  
www.irf.com  
1
2/4/00  

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