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IRHNJ4130SCS PDF预览

IRHNJ4130SCS

更新时间: 2024-11-05 19:44:27
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 428K
描述
Power Field-Effect Transistor,

IRHNJ4130SCS 技术参数

生命周期:Active包装说明:,
Reach Compliance Code:compliant风险等级:5.66
Base Number Matches:1

IRHNJ4130SCS 数据手册

 浏览型号IRHNJ4130SCS的Datasheet PDF文件第2页浏览型号IRHNJ4130SCS的Datasheet PDF文件第3页浏览型号IRHNJ4130SCS的Datasheet PDF文件第4页浏览型号IRHNJ4130SCS的Datasheet PDF文件第5页浏览型号IRHNJ4130SCS的Datasheet PDF文件第6页浏览型号IRHNJ4130SCS的Datasheet PDF文件第7页 
PD-93820C  
IRHNJ7130  
JANSR2N7380U3  
100V, N-CHANNEL  
REF: MIL-PRF-19500/614  
RAD-Hard HEXFET TECHNOLOGY  
RADIATION HARDENED  
POWER MOSFET  
SURFACE MOUNT (SMD-0.5)  
Product Summary  
Part Number  
IRHNJ7130  
IRHNJ3130  
IRHNJ5130  
IRHNJ8130  
Radiation Level  
100 kRads(Si)  
300 kRads(Si)  
500 kRads(Si)  
1000 kRads(Si)  
RDS(on)  
ID  
QPL Part Number  
14.4A  
14.4A  
14.4A  
14.4A  
JANSR2N7380U3  
JANSF2N7380U3  
JANSG2N7380U3  
JANSH2N7380U3  
0.18  
0.24  
0.24  
0.24  
Description  
Features  
IR HiRel RAD-Hard HEXFET technology provides high  
performance power MOSFETs for space applications.  
This technology has over a decade of proven performance  
and reliability in satellite applications. These devices have  
been characterized for both Total Dose and Single Event  
Effects (SEE). The combination of low Rdson and low gate  
charge reduces the power losses in switching applications  
such as DC to DC converters and motor control. These  
devices retain all of the well established advantages of  
MOSFETs such as voltage control, fast switching and  
temperature stability of electrical parameters.  
Single Event Effect (SEE) Hardened  
Low RDS(on)  
Low Total Gate Charge  
Simple Drive Requirements  
Hermetically Sealed  
Ceramic package  
Light Weight  
Surface Mount  
ESD Rating: Class 1C per MIL-STD-750,  
Method 1020  
Absolute Maximum Ratings  
Pre-Irradiation  
Symbol  
Value  
Parameter  
Units  
ID1 @ VGS = 12V, TC = 25°C Continuous Drain Current  
ID2 @ VGS = 12V, TC = 100°C Continuous Drain Current  
14.4  
A
9.1  
57.6  
75  
IDM @TC = 25°C  
PD @TC = 25°C  
Pulsed Drain Current  
W
W/°C  
V
Maximum Power Dissipation  
Linear Derating Factor  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy   
Avalanche Current   
0.6  
VGS  
EAS  
IAR  
± 20  
150  
14.4  
7.5  
mJ  
A
mJ  
V/ns  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy   
Peak Diode Recovery dv/dt   
Operating Junction and  
Storage Temperature Range  
Lead Temperature  
6.0  
-55 to + 150  
TSTG  
°C  
g
300 (5 sec)  
Weight  
1.0 (Typical)  
For Footnotes, refer to the page 2.  
1
International Rectifier HiRel Products, Inc.  
2019-02-05  

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