IRFZ48S, IRFZ48L, SiHFZ48S, SiHFZ48L
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
• Halogen-free According to IEC 61249-2-21
60
Definition
• Advanced Process Technology
• Surface Mount (IRFZ48S, SiHFZ48S)
• Low-Profile Through-Hole (IRFZ48L, SiHFZ48L)
• 175 °C Operating Temperature
• Fast Switching
R
DS(on) ()
VGS = 10 V
0.018
Qg (Max.) (nC)
110
29
Q
Q
gs (nC)
gd (nC)
36
Configuration
Single
• Compliant to RoHS Directive 2002/95/EC
D
DESCRIPTION
D2PAK (TO-263)
I2PAK (TO-262)
Third generation Power MOSFETs from Vishay utilize
advanced processing techniques to achieve extremely low
on-resistance per silicon area. This benefit, combined with
the fast switching speed and ruggedized device design that
Power MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use in a
wide variety of applications.
G
G
D
S
D
S
G
The D2PAK is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible
on-resistance in any existing surface mount package. The
D2PAK is suitable for high current applications because of
its low internal connection resistance and can dissipate up
to 2 W in a typical surface mount application.
S
N-Channel MOSFET
The through-hole version (IRFZ48L, SiHFZ48L) is available
for low-profile applications.
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
D2PAK (TO-263)
I2PAK (TO-262)
-
IRFZ48LPbF
SiHFZ48L-E3
SiHFZ48S-GE3
IRFZ48SPbF
SiHFZ48S-E3
Lead (Pb)-free
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
SYMBOL
VDS
LIMIT
60
20
UNIT
V
VGS
T
C = 25 °C
50
50
290
Continuous Drain Currentf
VGS at 10 V
ID
A
TC = 100 °C
Pulsed Drain Currenta, e
IDM
Linear Derating Factor
1.3
100
190
3.7
W/°C
mJ
Single Pulse Avalanche Energyb, e
EAS
PD
T
C = 25 °C
Maximum Power Dissipation
W
V/ns
°C
TA = 25 °C
Peak Diode Recovery dV/dtc, e
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d
dV/dt
TJ, Tstg
4.5
- 55 to + 175
300
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 25 V, Starting TJ = 25 °C, L = 22 μH, Rg = 25 , IAS = 72 A (see fig. 12).
c. ISD 72 A, dI/dt 200 A/μs, VDD VDS, TJ 175 °C.
d. 1.6 mm from case.
e. Uses IRFZ48, SiHFZ48 data and test conditions.
f. Calculated continuous current based on maximum allowable junction temperature.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 90377
S11-1045-Rev. C, 30-May-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000