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IRFH4257DPBF PDF预览

IRFH4257DPBF

更新时间: 2024-11-17 01:21:03
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
12页 861K
描述
Control and synchronous MOSFETs in one package

IRFH4257DPBF 数据手册

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FastIRFET™  
IRFH4257DPbF  
HEXFET® Power MOSFET  
Q1  
25  
Q2  
25  
VDSS  
V
RDS(on) max  
(@VGS = 4.5V)  
4.70  
9.7  
1.80  
23  
m  
nC  
Qg (typical)  
ID  
25  
25  
A
(@TC = 25°C)  
Applications  
Control and Synchronous MOSFETs for synchronous buck  
converters  
Features  
Benefits  
Control and synchronous MOSFETs in one package  
Increased power density  
Lower switching losses  
Lower conduction losses  
Lower Switching Losses  
Environmentally friendlier  
Increased reliability  
Low charge control MOSFET (9.7nC typical)  
results in  
Low RDSON synchronous MOSFET (<1.8m)  
Intrinsic Schottky Diode with Low Forward Voltage on Q2  
RoHS Compliant, Halogen-Free  
MSL1, Industrial Qualification  
Base part number  
Package Type  
Standard Pack  
Orderable Part Number  
IRFH4257DTRPbF  
Form  
Quantity  
4000  
IRFH4257DPbF  
Dual PQFN 5mm x 4mm  
Tape and Reel  
Absolute Maximum Ratings  
Parameter  
Gate-to-Source Voltage  
Q1 Max.  
Q2 Max.  
Units  
VGS  
± 20  
V
ID @ TC = 25°C  
Continuous Drain Current, VGS @ 4.5V  
Continuous Drain Current, VGS @ 4.5V  
68  
54  
111  
88  
ID @ TC = 70°C  
ID @ TC = 25°C  
A
Continuous Drain Current, VGS @ 4.5V  
(Source Bonding Technology Limited)  
25  
25  
IDM  
Pulsed Drain Current  
Power Dissipation  
Power Dissipation  
120  
25  
375  
28  
PD @TC = 25°C  
PD @TC = 70°C  
W
W/°C  
°C  
16  
18  
Linear Derating Factor  
0.20  
0.22  
TJ  
Operating Junction and  
Storage Temperature Range  
-55 to + 150  
TSTG  
Thermal Resistance  
Parameter  
Q1 Max.  
Q2 Max.  
Units  
Junction-to-Case   
5.0  
33  
45  
30  
4.5  
26  
40  
27  
RJC (Bottom)  
RJC (Top)  
RJA  
Junction-to-Case   
°C/W  
Junction-to-Ambient   
Junction-to-Ambient   
RJA (<10s)  
Notes through are on page 12  
1
www.irf.com  
© 2014 International Rectifier  
Submit Datasheet Feedback  
September 15, 2014  

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