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IRFBA1405 PDF预览

IRFBA1405

更新时间: 2024-10-29 22:51:35
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 238K
描述
Power MOSFET(Vdss=55V, Rds(on)=5.0mohm, Id=174A)

IRFBA1405 数据手册

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PD -94111  
AUTOMOTIVE MOSFET  
IRFBA1405P  
HEXFET® Power MOSFET  
Typical Applications  
Electric Power Steering (EPS)  
Anti-lock Braking System (ABS)  
Wiper Control  
Climate Control  
Power Door  
D
VDSS = 55V  
Benefits  
Advanced Process Technology  
RDS(on) = 5.0mΩ  
Ultra Low On-Resistance  
Dynamic dv/dt Rating  
G
ID = 174A†  
175°C Operating Temperature  
Fast Switching  
S
Repetitive Avalanche Allowed up to Tjmax  
Description  
Specifically designed for Automotive applications, this Stripe Planar  
design of HEXFET® Power MOSFETs utilizes the latest processing  
techniques to achieve extremely low on-resistance per silicon area.  
Additional features of this MOSFET are a 175oC junction operating  
temperature, fast switching speed and improved ruggedness in  
single and repetitive avalanche. The Super-220 TM is a package that  
has been designed to have the same mechanical outline and pinout  
as the industry standard TO-220 but can house a considerably  
larger silicon die. The result is significantly increased current  
handling capability over both the TO-220 and the much larger TO-  
247 package. The combination of extremely low on-resistance  
silicon and the Super-220 TM package makes it ideal to reduce the  
component count in multiparalled TO-220 applications, reduce  
system power dissipation, upgrade existing designs or have TO-247  
performance in a TO-220 outline. This package has been designed  
to meet automotive, Q101, qualification standard.  
Super-220™  
These benefits make this design an extremely efficient and reliable  
device for use in Automotive applications and a wide variety of other  
applications.  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
174†  
123†  
A
680  
PD @TC = 25°C  
Power Dissipation  
330  
W
W/°C  
V
Linear Derating Factor  
2.2  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
± 20  
560  
Single Pulse Avalanche Energy‚  
Avalanche Current  
mJ  
A
See Fig.12a, 12b, 15, 16  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy‡  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
mJ  
V/ns  
5.0  
-40 to + 175  
-55 to + 175  
300 (1.6mm from case )  
20  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Recommended clip force  
°C  
N
www.irf.com  
1
3/1/01  

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