PD -94111
AUTOMOTIVE MOSFET
IRFBA1405P
HEXFET® Power MOSFET
Typical Applications
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Electric Power Steering (EPS)
Anti-lock Braking System (ABS)
Wiper Control
Climate Control
Power Door
D
VDSS = 55V
Benefits
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Advanced Process Technology
RDS(on) = 5.0mΩ
Ultra Low On-Resistance
Dynamic dv/dt Rating
G
ID = 174A
175°C Operating Temperature
Fast Switching
S
Repetitive Avalanche Allowed up to Tjmax
Description
Specifically designed for Automotive applications, this Stripe Planar
design of HEXFET® Power MOSFETs utilizes the latest processing
techniques to achieve extremely low on-resistance per silicon area.
Additional features of this MOSFET are a 175oC junction operating
temperature, fast switching speed and improved ruggedness in
single and repetitive avalanche. The Super-220 TM is a package that
has been designed to have the same mechanical outline and pinout
as the industry standard TO-220 but can house a considerably
larger silicon die. The result is significantly increased current
handling capability over both the TO-220 and the much larger TO-
247 package. The combination of extremely low on-resistance
silicon and the Super-220 TM package makes it ideal to reduce the
component count in multiparalled TO-220 applications, reduce
system power dissipation, upgrade existing designs or have TO-247
performance in a TO-220 outline. This package has been designed
to meet automotive, Q101, qualification standard.
Super-220™
These benefits make this design an extremely efficient and reliable
device for use in Automotive applications and a wide variety of other
applications.
Absolute Maximum Ratings
Parameter
Max.
Units
ID @ TC = 25°C
ID @ TC = 100°C
IDM
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
174
123
A
680
PD @TC = 25°C
Power Dissipation
330
W
W/°C
V
Linear Derating Factor
2.2
VGS
EAS
IAR
Gate-to-Source Voltage
± 20
560
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
See Fig.12a, 12b, 15, 16
EAR
dv/dt
TJ
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
mJ
V/ns
5.0
-40 to + 175
-55 to + 175
300 (1.6mm from case )
20
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
Recommended clip force
°C
N
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