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IRFBA32N50K PDF预览

IRFBA32N50K

更新时间: 2024-10-30 04:23:19
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
3页 44K
描述
HEXFET㈢ Power MOSFET

IRFBA32N50K 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:IN-LINE, R-PSIP-T3Reach Compliance Code:compliant
风险等级:5.8其他特性:AVALANCHE RATED
雪崩能效等级(Eas):760 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:500 V
最大漏极电流 (ID):32 A最大漏源导通电阻:0.14 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSIP-T3
JESD-609代码:e3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):128 A
认证状态:Not Qualified表面贴装:NO
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFBA32N50K 数据手册

 浏览型号IRFBA32N50K的Datasheet PDF文件第2页浏览型号IRFBA32N50K的Datasheet PDF文件第3页 
PD- 93924  
PROVISIONAL  
IRFBA32N50K  
SMPS MOSFET  
HEXFET® Power MOSFET  
Applications  
l Telecom and Data-Com off-Line SMPS  
VDSS  
RDS(on)  
ID  
l UninterruptIble Power Supply  
Benefits  
l Low On-Resistance  
500V  
0.14Ω  
32A  
l High Speed Switching  
l Low Gate Drive Current Due to Improved  
Gate Charge Characteristics  
l Improved Avalanche Ruggedness and  
Dynamic dv/dt, Fully Characterized  
Avalanche Voltage and Current  
Super-220™  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
32  
20  
A
128  
PD @TC = 25°C  
Power Dissipation  
360  
W
W/°C  
V
Linear Derating Factor  
2.9  
VGS  
dv/dt  
TJ  
Gate-to-Source Voltage  
± 30  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
5.0  
V/ns  
-55 to + 150  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
(1.6mm from case )  
300  
20  
°C  
Recommended clip force  
N
Diode Characteristics  
Symbol  
Parameter  
Min. Typ. Max. Units  
32  
Conditions  
MOSFET symbol  
D
IS  
Continuous Source Current  
(Body Diode)  
––– –––  
showing the  
A
G
ISM  
Pulsed Source Current  
(Body Diode)   
integral reverse  
p-n junction diode.  
––– ––– 128  
S
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse RecoveryCharge  
Forward Turn-On Time  
––– ––– 1.5  
––– 650 –––  
––– 9.0 –––  
V
TJ = 25°C, IS = 32A, VGS = 0V „  
TJ = 125°C, IF = 32A  
ns  
Qrr  
ton  
µC di/dt = 100A/µs „  
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)  
Typical SMPS Topologies  
l
l
l
Hard Switching Full and Half Bridge Circuits  
Hard Switching Single Transistor Circuits  
Power Factor Correction Circuits  
www.irf.com  
1
6/2/00  

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