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IRF9540NSPBF PDF预览

IRF9540NSPBF

更新时间: 2024-10-30 04:23:19
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
11页 328K
描述
HEXFET POWER MOSFET (VDSS = -100V , RDS(on) = 117mヘ , ID = -23A )

IRF9540NSPBF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:7.43
Is Samacsys:N其他特性:AVALANCHE RATED, HIGH RELIABILITY
雪崩能效等级(Eas):84 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):23 A最大漏极电流 (ID):23 A
最大漏源导通电阻:0.117 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):110 W最大脉冲漏极电流 (IDM):92 A
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRF9540NSPBF 数据手册

 浏览型号IRF9540NSPBF的Datasheet PDF文件第2页浏览型号IRF9540NSPBF的Datasheet PDF文件第3页浏览型号IRF9540NSPBF的Datasheet PDF文件第4页浏览型号IRF9540NSPBF的Datasheet PDF文件第5页浏览型号IRF9540NSPBF的Datasheet PDF文件第6页浏览型号IRF9540NSPBF的Datasheet PDF文件第7页 
PD - 96030  
IRF9540NSPbF  
IRF9540NLPbF  
HEXFET® Power MOSFET  
l Advanced Process Technology  
l Ultra Low On-Resistance  
l 150°C Operating Temperature  
l Fast Switching  
l Repetitive Avalanche Allowed up to Tjmax  
l Some Parameters are Different from  
IRF9540NS/L  
D
VDSS = -100V  
RDS(on) = 117mΩ  
G
ID = -23A  
S
l P-Channel  
l Lead-Free  
D
Description  
D
Features of this design are a 150°C junction  
operating temperature, fast switching speed and  
improvedrepetitiveavalancherating. Thesefea-  
tures combine to make this design an extremely  
efficient and reliable device for use in a wide  
variety of other applications.  
S
S
D
D
G
G
D2Pak  
TO-262  
IRF9540NLPbF  
IRF9540NSPbF  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
I
I
I
@ TC = 25°C  
@ TC = 100°C  
Continuous Drain Current, VGS @ -10V  
Continuous Drain Current, VGS @ -10V  
Pulsed Drain Current  
-23  
A
D
D
-14  
-92  
3.1  
110  
DM  
P
P
@TA = 25°C  
@TC = 25°C  
Maximum Power Dissipation  
Maximum Power Dissipation  
W
D
D
Linear Derating Factor  
0.9  
W/°C  
V
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy  
± 20  
GS  
EAS  
IAR  
84  
-14  
11  
mJ  
A
Avalanche Current  
Repetitive Avalanche Energy  
EAR  
dv/dt  
mJ  
Peak Diode Recovery dv/dt  
Operating Junction and  
-13  
V/ns  
°C  
T
T
-55 to + 150  
J
Storage Temperature Range  
STG  
Soldering Temperature, for 10 seconds  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
1.1  
Units  
°C/W  
RθJC  
Junction-to-Case  
Junction-to-Ambient (PCB Mount, steady state)  
RθJA  
–––  
40  
www.irf.com  
1
09/30/05  

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