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IRF9540S, SiHF9540S PDF预览

IRF9540S, SiHF9540S

更新时间: 2024-10-31 14:54:23
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威世 - VISHAY /
页数 文件大小 规格书
9页 201K
描述
Power MOSFET

IRF9540S, SiHF9540S 数据手册

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IRF9540S, SiHF9540S  
www.vishay.com  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Surface-mount  
S
D2PAK (TO-263)  
• Available in tape and reel  
• Dynamic dV/dt rating  
• Repetitive avalanche rated  
• P-channel  
Available  
Available  
G
• 175 °C operating temperature  
• Fast Switching  
D
G
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
Note  
S
D
P-Channel MOSFET  
*
This datasheet provides information about parts that are  
RoHS-compliant and / or parts that are non RoHS-compliant. For  
example, parts with lead (Pb) terminations are not RoHS-compliant.  
Please see the information / tables in this datasheet for details  
PRODUCT SUMMARY  
VDS (V)  
-100  
DESCRIPTION  
RDS(on) ()  
VGS = -10 V  
0.20  
Third generation power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
Qg max. (nC)  
61  
14  
29  
Q
gs (nC)  
gd (nC)  
Q
The D2PAK (TO-263) is a surface-mount power package  
capable of accommodating die sizes up to HEX-4. It  
provides the highest power capability and the lowest  
possible on-resistance in any existing surface-mount  
package. The D2PAK (TO-263) is suitable for high current  
applications because of its low internal connection  
resistance and can dissipate up to 2.0 W in a typical surface  
mount application.  
Configuration  
Single  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
SiHF9540S-GE3  
IRF9540SPbF  
D2PAK (TO-263)  
SiHF9540STRL-GE3 a  
IRF9540STRLPbF a  
Lead (Pb)-free and Halogen-free  
Lead (Pb)-free  
Note  
a. See device orientation  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
-100  
20  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
V
TC = 25 °C  
TC = 100 °C  
-19  
-13  
-72  
Continuous Drain Current  
V
GS at -10 V  
ID  
A
Pulsed Drain Current a  
IDM  
Linear Derating Factor  
1.0  
0.025  
640  
-19  
15  
W/°C  
Linear Derating Factor (PCB mount) e  
Single Pulse Avalanche Energy b  
Repetitive Avalanche Current a  
EAS  
IAR  
EAR  
mJ  
A
mJ  
Repetitive Avalanche Energy a  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB mount) e  
Peak Diode Recovery dV/dt c  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak temperature) d  
150  
3.7  
-5.5  
T
C = 25 °C  
PD  
W
V/ns  
°C  
dV/dt  
TJ, Tstg  
-55 to +175  
300  
For 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)  
b. VDD = -25 V, starting TJ = 25 °C, L = 2.7 mH, Rg = 25 , IAS = -19 A (see fig. 12)  
c. ISD -19 A, dI/dt 200 A/μs, VDD VDS, TJ 175 °C  
d. 1.6 mm from case  
e. When mounted on 1" square PCB (FR-4 or G-10 material)  
S21-0943-Rev. D, 20-Sep-2021  
Document Number: 91079  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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