IRF9540S, SiHF9540S
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
• Surface-mount
S
D2PAK (TO-263)
• Available in tape and reel
• Dynamic dV/dt rating
• Repetitive avalanche rated
• P-channel
Available
Available
G
• 175 °C operating temperature
• Fast Switching
D
G
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
S
D
P-Channel MOSFET
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
PRODUCT SUMMARY
VDS (V)
-100
DESCRIPTION
RDS(on) ()
VGS = -10 V
0.20
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
Qg max. (nC)
61
14
29
Q
gs (nC)
gd (nC)
Q
The D2PAK (TO-263) is a surface-mount power package
capable of accommodating die sizes up to HEX-4. It
provides the highest power capability and the lowest
possible on-resistance in any existing surface-mount
package. The D2PAK (TO-263) is suitable for high current
applications because of its low internal connection
resistance and can dissipate up to 2.0 W in a typical surface
mount application.
Configuration
Single
ORDERING INFORMATION
Package
D2PAK (TO-263)
SiHF9540S-GE3
IRF9540SPbF
D2PAK (TO-263)
SiHF9540STRL-GE3 a
IRF9540STRLPbF a
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
Note
a. See device orientation
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
-100
20
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
V
TC = 25 °C
TC = 100 °C
-19
-13
-72
Continuous Drain Current
V
GS at -10 V
ID
A
Pulsed Drain Current a
IDM
Linear Derating Factor
1.0
0.025
640
-19
15
W/°C
Linear Derating Factor (PCB mount) e
Single Pulse Avalanche Energy b
Repetitive Avalanche Current a
EAS
IAR
EAR
mJ
A
mJ
Repetitive Avalanche Energy a
Maximum Power Dissipation
Maximum Power Dissipation (PCB mount) e
Peak Diode Recovery dV/dt c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak temperature) d
150
3.7
-5.5
T
C = 25 °C
PD
W
V/ns
°C
dV/dt
TJ, Tstg
-55 to +175
300
For 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. VDD = -25 V, starting TJ = 25 °C, L = 2.7 mH, Rg = 25 , IAS = -19 A (see fig. 12)
c. ISD -19 A, dI/dt 200 A/μs, VDD VDS, TJ 175 °C
d. 1.6 mm from case
e. When mounted on 1" square PCB (FR-4 or G-10 material)
S21-0943-Rev. D, 20-Sep-2021
Document Number: 91079
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000