IRF840, SiHF840
Vishay Siliconix
Power MOSFET
FEATURES
• Dynamic dV/dt Rating
PRODUCT SUMMARY
VDS (V)
500
Available
• Repetitive Avalanche Rated
• Fast Switching
R
DS(on) (Ω)
VGS = 10 V
0.85
RoHS*
Qg (Max.) (nC)
63
9.3
COMPLIANT
• Ease of Paralleling
Q
Q
gs (nC)
gd (nC)
32
• Simple Drive Requirements
• Lead (Pb)-free Available
Configuration
Single
D
DESCRIPTION
TO-220
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
G
The TO-220 package is universally preferred for all
commercial-industrial applications at power dissipation
levels to approximately 50 W. The low thermal resistance
and low package cost of the TO-220 contribute to its wide
acceptance throughout the industry.
S
D
S
N-Channel MOSFET
G
ORDERING INFORMATION
Package
TO-220
IRF840PbF
SiHF840-E3
IRF840
Lead (Pb)-free
SnPb
SiHF840
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
UNIT
V
Drain-Source Voltage
Gate-Source Voltage
VDS
500
20
VGS
V
TC = 25 °C
TC =100°C
8.0
Continuous Drain Current
V
GS at 10 V
ID
5.1
A
Pulsed Drain Currenta
IDM
32
Linear Derating Factor
1.0
W/°C
mJ
A
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
Repetitive Avalanche Energya
EAS
IAR
510
8.0
EAR
13
mJ
W
Maximum Power Dissipation
Peak Diode Recovery dV/dtc
T
C = 25 °C
PD
125
3.5
dV/dt
TJ, Tstg
V/ns
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
- 55 to + 150
300d
10
°C
for 10 s
6-32 or M3 screw
lbf · in
N · m
Mounting Torque
1.1
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 50 V, starting TJ = 25 °C, L = 14 mH, RG = 25 Ω, IAS = 8.0 A (see fig. 12).
c. ISD ≤ 8.0 A, dI/dt ≤ 100 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91070
S-81290-Rev. B, 16-Jun-08
www.vishay.com
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