IRF840S, SiHF840S
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
• Surface-mount
D
D2PAK (TO-263)
• Available in tape and reel
• Dynamic dV/dt rating
• Repetitive avalanche rated
• Fast switching
Available
Available
G
• Ease of paralleling
• Simple drive requirement
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
D
G
S
S
Note
N-Channel MOSFET
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
PRODUCT SUMMARY
VDS (V)
DESCRIPTION
500
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The D2PAK (TO-263) is a surface-mount power package
capable of accommodating die size up to HEX-4. It provides
the highest power capability and the lowest possible
on-resistance in any existing surface-mount package. The
D2PAK (TO-263) is suitable for high current applications
because of its low internal connection resistance and can
dissipate up to 2.0 W in a typical surface mount application.
R
DS(on) (Ω)
VGS = 10 V
0.85
Qg max. (nC)
63
9.3
Q
gs (nC)
gd (nC)
Q
32
Configuration
Single
ORDERING INFORMATION
Package
D2PAK (TO-263)
SiHF840S-GE3
IRF840SPbF
D2PAK (TO-263)
SiHF840STRL-GE3 a
IRF840STRLPbF a
D2PAK (TO-263)
SiHF840STRR-GE3 a
IRF840STRRPbF a
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
Note
a. See device orientation
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
500
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
20
T
C = 25 °C
8.0
Continuous Drain Current
V
GS at 10 V
ID
TC = 100 °C
5.1
A
Pulsed Drain Current a
IDM
32
Linear Derating Factor
1.0
W/°C
Linear Derating Factor (PCB mount) e
Single Pulse Avalanche Energy b
Avalanche Current a
0.025
510
EAS
IAR
mJ
A
8.0
Repetitive Avalanche Energy a
EAR
13
mJ
Maximum Power Dissipation
TC = 25 °C
125
PD
W
V/ns
°C
Maximum Power Dissipation (PCB mount) e
Peak Diode Recovery dV/dt c
TA = 25 °C
3.1
dV/dt
3.5
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak temperature) d
TJ, Tstg
-55 to +150
300
For 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. VDD = 50 V, starting TJ = 25 °C, L = 14 mH, Rg = 25 Ω, IAS = 8.0 A (see fig. 12)
c. ISD ≤ 8.0 A, dI/dt ≤ 100 A/μs, VDD ≤ VDS, TJ ≤ 150 °C
d. 1.6 mm from case
e. When mounted on 1" square PCB (FR-4 or G-10 material)
S21-0904-Rev. E, 30-Aug-2021
Document Number: 91071
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000