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IRF840S, SiHF840S PDF预览

IRF840S, SiHF840S

更新时间: 2024-11-03 14:55:47
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威世 - VISHAY /
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Power MOSFET

IRF840S, SiHF840S 数据手册

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IRF840S, SiHF840S  
www.vishay.com  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Surface-mount  
D
D2PAK (TO-263)  
• Available in tape and reel  
• Dynamic dV/dt rating  
• Repetitive avalanche rated  
• Fast switching  
Available  
Available  
G
• Ease of paralleling  
• Simple drive requirement  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
D
G
S
S
Note  
N-Channel MOSFET  
*
This datasheet provides information about parts that are  
RoHS-compliant and / or parts that are non RoHS-compliant. For  
example, parts with lead (Pb) terminations are not RoHS-compliant.  
Please see the information / tables in this datasheet for details  
PRODUCT SUMMARY  
VDS (V)  
DESCRIPTION  
500  
Third generation power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
The D2PAK (TO-263) is a surface-mount power package  
capable of accommodating die size up to HEX-4. It provides  
the highest power capability and the lowest possible  
on-resistance in any existing surface-mount package. The  
D2PAK (TO-263) is suitable for high current applications  
because of its low internal connection resistance and can  
dissipate up to 2.0 W in a typical surface mount application.  
R
DS(on) (Ω)  
VGS = 10 V  
0.85  
Qg max. (nC)  
63  
9.3  
Q
gs (nC)  
gd (nC)  
Q
32  
Configuration  
Single  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
SiHF840S-GE3  
IRF840SPbF  
D2PAK (TO-263)  
SiHF840STRL-GE3 a  
IRF840STRLPbF a  
D2PAK (TO-263)  
SiHF840STRR-GE3 a  
IRF840STRRPbF a  
Lead (Pb)-free and Halogen-free  
Lead (Pb)-free  
Note  
a. See device orientation  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
500  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
20  
T
C = 25 °C  
8.0  
Continuous Drain Current  
V
GS at 10 V  
ID  
TC = 100 °C  
5.1  
A
Pulsed Drain Current a  
IDM  
32  
Linear Derating Factor  
1.0  
W/°C  
Linear Derating Factor (PCB mount) e  
Single Pulse Avalanche Energy b  
Avalanche Current a  
0.025  
510  
EAS  
IAR  
mJ  
A
8.0  
Repetitive Avalanche Energy a  
EAR  
13  
mJ  
Maximum Power Dissipation  
TC = 25 °C  
125  
PD  
W
V/ns  
°C  
Maximum Power Dissipation (PCB mount) e  
Peak Diode Recovery dV/dt c  
TA = 25 °C  
3.1  
dV/dt  
3.5  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak temperature) d  
TJ, Tstg  
-55 to +150  
300  
For 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)  
b. VDD = 50 V, starting TJ = 25 °C, L = 14 mH, Rg = 25 Ω, IAS = 8.0 A (see fig. 12)  
c. ISD 8.0 A, dI/dt 100 A/μs, VDD VDS, TJ 150 °C  
d. 1.6 mm from case  
e. When mounted on 1" square PCB (FR-4 or G-10 material)  
S21-0904-Rev. E, 30-Aug-2021  
Document Number: 91071  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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