IRF830A, SiHF830A
Vishay Siliconix
Power MOSFET
FEATURES
• Low Gate Charge Qg Results in Simple Drive
Requirement
PRODUCT SUMMARY
VDS (V)
500
Available
R
DS(on) (Ω)
VGS = 10 V
1.4
RoHS*
• Improved Gate, Avalanche and Dynamic dV/dt
Ruggedness
Qg (Max.) (nC)
24
6.3
COMPLIANT
Q
Q
gs (nC)
gd (nC)
• Fully Characterized Capacitance and Avalanche Voltage
and Current
11
Configuration
Single
• Effective Coss Specified
• Lead (Pb)-free Available
D
TO-220
APPLICATIONS
• Switch Mode Power Supply (SMPS)
• Uninterruptable Power Supply
• High Speed power Switching
G
S
TYPICAL SMPS TOPOLOGIES
• Two Transistor Forward
• Half Bridge
D
G
S
N-Channel MOSFET
• Full Bridge
ORDERING INFORMATION
Package
TO-220
IRF830APbF
SiHF830A-E3
IRF830A
Lead (Pb)-free
SnPb
SiHF830A
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
500
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
30
T
C = 25 °C
5.0
Continuous Drain Current
VGS at 10 V
ID
TC =100°C
3.2
A
Pulsed Drain Currenta
IDM
20
Linear Derating Factor
0.59
230
W/°C
mJ
A
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
Repetitive Avalanche Energya
EAS
IAR
5.0
EAR
7.4
mJ
W
Maximum Power Dissipation
T
C = 25 °C
PD
74
Peak Diode Recovery dV/dtc
dV/dt
TJ, Tstg
5.3
V/ns
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
- 55 to + 150
300d
10
°C
for 10 s
6-32 or M3 screw
lbf · in
N · m
Mounting Torque
1.1
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Starting TJ = 25 °C, L = 18 mH, RG = 25 Ω, IAS = 5.0 A (see fig. 12).
c. ISD ≤ 5.0 A, dI/dt ≤ 370 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91061
S-81145-Rev. B, 02-Jun-08
www.vishay.com
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