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IRF6218L PDF预览

IRF6218L

更新时间: 2024-11-12 04:23:15
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
9页 225K
描述
HEXFET Power MOSFET

IRF6218L 数据手册

 浏览型号IRF6218L的Datasheet PDF文件第2页浏览型号IRF6218L的Datasheet PDF文件第3页浏览型号IRF6218L的Datasheet PDF文件第4页浏览型号IRF6218L的Datasheet PDF文件第5页浏览型号IRF6218L的Datasheet PDF文件第6页浏览型号IRF6218L的Datasheet PDF文件第7页 
PD - 95863  
IRF6218S  
SMPS MOSFET  
IRF6218L  
HEXFET® Power MOSFET  
Applications  
l Reset Switch for Active Clamp  
VDSS  
RDS(on) max  
ID  
Reset DC-DC converters  
150m @VGS = -10V  
-150V  
-27A  
Benefits  
D
l Low Gate to Drain Charge to Reduce  
Switching Losses  
l Fully Characterized Capacitance Including  
Effective COSS to Simplify Design (See  
App. Note AN1001)  
l Fully Characterized Avalanche Voltage  
and Current  
G
D2Pak  
IRF6218S  
TO-262  
IRF6218L  
S
Absolute Maximum Ratings  
Parameter  
Max.  
-150  
± 20  
-27  
Units  
VDS  
VGS  
Drain-to-Source Voltage  
V
Gate-to-Source Voltage  
I
I
I
@ T = 25°C  
A
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
D
D
C
@ T = 100°C  
C
-19  
-110  
250  
DM  
P
@T = 25°C  
Maximum Power Dissipation  
C
W
D
Linear Derating Factor  
1.6  
W/°C  
dv/dt  
T
J
Peak Diode Recovery dv/dt  
Operating Junction and  
8.2  
V/ns  
°C  
-55 to + 175  
T
Storage Temperature Range  
STG  
Soldering Temperature, for 10 seconds  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
0.61  
40  
Units  
Rθ  
°C/W  
JC  
JA  
Junction-to-Case  
Junction-to-Ambient (PCB Mounted, steady state)  
Rθ  
–––  
Notes  through † are on page 9  
www.irf.com  
1
4/22/04  

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