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IMX53AEC

更新时间: 2024-09-16 11:20:03
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飞思卡尔 - FREESCALE /
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178页 2649K
描述
Automotive and Infotainment Applications Processors

IMX53AEC 数据手册

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Document Number: IMX53AEC  
Rev. 2, 5/2011  
Freescale Semiconductor  
Data Sheet: Advance Information  
MCIMX53xA  
i.MX53xA Automotive and  
InfotainmentApplications  
Processors  
Package Information  
Plastic Package  
Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch  
Ordering Information  
See Table 1 on page 3  
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3  
1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
3.1. Special Signal Considerations . . . . . . . . . . . . . . . 17  
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 17  
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 17  
4.2. Power Supplies Requirements and Restrictions . 24  
4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 27  
4.4. Output Buffer Impedance Characteristics . . . . . . 34  
4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 38  
4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 45  
4.7. External Peripheral Interfaces Parameters . . . . . . 67  
4.8. XTAL Electrical Specifications . . . . . . . . . . . . . . 148  
5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 149  
5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . 149  
5.2. Boot Devices Interfaces Allocation . . . . . . . . . . . 150  
5.3. Power setup during Boot . . . . . . . . . . . . . . . . . . 151  
6. Package Information and Contact Assignments . . . . . 152  
6.1. 19x19 mm Package Information . . . . . . . . . . . . . 152  
6.2. 19 x 19 mm, 0.8 Pitch Ball Map . . . . . . . . . . . . . 171  
7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175  
1 Introduction  
The MCIMX53xA (i.MX53xA) automotive  
infotainment processor is Freescale Semiconductor’s  
latest addition to a growing family of  
multimedia-focused products offering high performance  
processing with a high degree of functional integration  
aimed at the growing automotive infotainment,  
telematics, HMI, and display-based cluster markets. This  
device includes 3D and 2D graphics processors, 1080i/p  
video processing, and dual display, and provides a  
variety of interfaces.  
The i.MX53xA processor features Freescale’s advanced  
implementation of the ARM™ core, which operates at  
clock speeds as high as 800 MHz and interfaces with  
DDR2/LVDDR2-800, LPDDR2-800, or DDR3-800  
DRAM memories. This device is well suited for  
graphics rendering for HMI, navigation, high  
performance speech processing with large databases,  
video processing and display, audio playback, and many  
other applications.  
The flexibility of the i.MX53xA architecture allows for  
its use in a wide variety of applications. As the heart of  
This document contains information on a new product. Specifications and information herein  
are subject to change without notice.  
© 2011 Freescale Semiconductor, Inc. All rights reserved.  

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