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HN58C256AP-10 PDF预览

HN58C256AP-10

更新时间: 2024-01-07 07:54:15
品牌 Logo 应用领域
日立 - HITACHI 存储内存集成电路光电二极管可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数 文件大小 规格书
25页 126K
描述
256k EEPROM (32-kword x 8-bit) Ready/Busy and RES function (HN58C257A)

HN58C256AP-10 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:DIP
包装说明:DIP, DIP28,.6针数:28
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.51风险等级:5.66
最长访问时间:100 ns命令用户界面:NO
数据轮询:YES耐久性:100000 Write/Erase Cycles
JESD-30 代码:R-PDIP-T28长度:35.6 mm
内存密度:262144 bit内存集成电路类型:EEPROM
内存宽度:8湿度敏感等级:1
功能数量:1端子数量:28
字数:32768 words字数代码:32000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:32KX8
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装等效代码:DIP28,.6封装形状:RECTANGULAR
封装形式:IN-LINE页面大小:64 words
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:5 V编程电压:5 V
认证状态:Not Qualified座面最大高度:5.7 mm
最大待机电流:0.00002 A子类别:EEPROMs
最大压摆率:0.03 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:COMMERCIAL端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED切换位:YES
宽度:15.24 mm最长写入周期时间 (tWC):10 ms
Base Number Matches:1

HN58C256AP-10 数据手册

 浏览型号HN58C256AP-10的Datasheet PDF文件第19页浏览型号HN58C256AP-10的Datasheet PDF文件第20页浏览型号HN58C256AP-10的Datasheet PDF文件第21页浏览型号HN58C256AP-10的Datasheet PDF文件第22页浏览型号HN58C256AP-10的Datasheet PDF文件第23页浏览型号HN58C256AP-10的Datasheet PDF文件第24页 
HN58C256A Series, HN58C257A Series  
When using this document, keep the following in mind:  
1. This document may, wholly or partially, be subject to change without notice.  
2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of  
this document without Hitachi’s permission.  
3. Hitachi will not be held responsible for any damage to the user that may result from accidents or any other  
reasons during operation of the user’s unit according to this document.  
4. Circuitry and other examples described herein are meant merely to indicate the characteristics and  
performance of Hitachi’s semiconductor products. Hitachi assumes no responsibility for any intellectual  
property claims or other problems that may result from applications based on the examples described  
herein.  
5. No license is granted by implication or otherwise under any patents or other rights of any third party or  
Hitachi, Ltd.  
6. MEDICAL APPLICATIONS: Hitachi’s products are not authorized for use in MEDICAL  
APPLICATIONS without the written consent of the appropriate officer of Hitachi’s sales company. Such  
use includes, but is not limited to, use in life support systems. Buyers of Hitachi’s products are requested  
to notify the relevant Hitachi sales offices when planning to use the products in MEDICAL  
APPLICATIONS.  
Hitachi, Ltd.  
Semiconductor & IC Div.  
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100, Japan  
Tel: Tokyo (03) 3270-2111  
Fax: (03) 3270-5109  
For further information write to:  
Hitachi America, Ltd.  
Semiconductor & IC Div.  
2000 Sierra Point Parkway  
Brisbane, CA. 94005-1835  
U S A  
Hitachi Europe GmbH  
Electronic Components Group  
Continental Europe  
Dornacher Straße 3  
D-85622 Feldkirchen  
München  
Hitachi Europe Ltd.  
Electronic Components Div.  
Northern Europe Headquarters  
Whitebrook Park  
Lower Cookham Road  
Maidenhead  
Hitachi Asia Pte. Ltd.  
16 Collyer Quay #20-00  
Hitachi Tower  
Singapore 0104  
Tel: 535-2100  
Tel: 415-589-8300  
Fax: 535-1533  
Fax: 415-583-4207  
Tel: 089-9 91 80-0  
Fax: 089-9 29 30 00  
Berkshire SL6 8YA  
United Kingdom  
Hitachi Asia (Hong Kong) Ltd.  
Unit 706, North Tower,  
World Finance Centre,  
Harbour City, Canton Road  
Tsim Sha Tsui, Kowloon  
Hong Kong  
Tel: 0628-585000  
Fax: 0628-778322  
Tel: 27359218  
Fax: 27306071  
25  

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