FQP12N60C/FQPF12N60C
600V N-Channel MOSFET
General Description
Features
•
•
•
•
•
•
12A, 600V, R
= 0.65Ω @V = 10 V
DS(on) GS
These N-Channel enhancement mode power field effect
transistors are produced using Corise Semiconductorÿs proprietary,
planar stripe, DMOS technology.
Low gate charge ( typical 48 nC)
Low Crss ( typical 21 pF)
Fast switching
100% avalanche tested
Improved dv/dt capability
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for high efficiency switch mode power supply.
D
!
●
◀
▲
●
●
G!
TO-220F
FQPF Series
TO-220
FQP Series
G D
S
G
D S
!
S
Absolute Maximum Ratings
T = 25°C unless otherwise noted
C
Symbol
Parameter
FQP12N60C
FQPF12N60C
600
Units
V
V
I
Drain-Source Voltage
DSS
- Continuous (T = 25°C)
Drain Current
12
7.4
48
12 *
7.4 *
48 *
A
D
C
- Continuous (T = 100°C)
A
C
I
(Note 1)
Drain Current
- Pulsed
A
DM
V
E
I
Gate-Source Voltage
± 30
870
12
V
GSS
AS
(Note 2)
(Note 1)
(Note 1)
(Note 3)
Single Pulsed Avalanche Energy
Avalanche Current
mJ
A
AR
E
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
22.5
4.5
mJ
V/ns
W
AR
dv/dt
P
Power Dissipation (T = 25°C)
225
51
D
C
- Derate above 25°C
Operating and Storage Temperature Range
1.78
0.41
W/°C
°C
T , T
-55 to +150
300
J
STG
Maximum lead temperature for soldering purposes,
T
°C
L
1/8" from case for 5 seconds
* Drain current limited by maximum junction temperature.
Thermal Characteristics
Symbol
Parameter
FQP12N60C
0.56
FQPF12N60C
Units
°C/W
°C/W
°C/W
R
R
R
Thermal Resistance, Junction-to-Case
Thermal Resistance, Case-to-Sink Typ.
Thermal Resistance, Junction-to-Ambient
2.43
--
θJC
0.5
θJS
62.5
62.5
θJA