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FQPF13N50T PDF预览

FQPF13N50T

更新时间: 2024-11-16 12:35:07
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
10页 1283K
描述
N-Channel QFET MOSFET

FQPF13N50T 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TO-220F包装说明:FLANGE MOUNT, R-PSFM-T3
针数:3Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.8
雪崩能效等级(Eas):810 mJ外壳连接:ISOLATED
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:500 V
最大漏极电流 (Abs) (ID):12.5 A最大漏极电流 (ID):7.3 A
最大漏源导通电阻:0.43 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT APPLICABLE
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):56 W
最大脉冲漏极电流 (IDM):29.2 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT APPLICABLE
晶体管应用:SWITCHING晶体管元件材料:SILICON

FQPF13N50T 数据手册

 浏览型号FQPF13N50T的Datasheet PDF文件第2页浏览型号FQPF13N50T的Datasheet PDF文件第3页浏览型号FQPF13N50T的Datasheet PDF文件第4页浏览型号FQPF13N50T的Datasheet PDF文件第5页浏览型号FQPF13N50T的Datasheet PDF文件第6页浏览型号FQPF13N50T的Datasheet PDF文件第7页 
March 2013  
FQP13N50 / FQPF13N50  
N-Channel QFET MOSFET  
500 V, 12.5 A, 430 mΩ  
Description  
Features  
This N-Channel enhancement mode power MOSFET is  
produced using Fairchild Semiconductor®’s proprietary  
planar stripe and DMOS technology. This advanced  
MOSFET technology has been especially tailored to reduce  
on-state resistance, and to provide superior switching  
performance and high avalanche energy strength. These  
devices are suitable for switched mode power supplies,  
active power factor correction (PFC), and electronic lamp  
ballasts.  
12.5 A, 500 V, RDS(on) = 430 m(Max) @VGS = 10 V,  
ID = 6.25 A  
Low Gate Charge (Typ. 45 nC)  
Low Crss (Typ. 25 pF)  
100% Avalanche Tested  
D
!
G!  
TO-220F  
FQPF Series  
TO-220  
FQP Series  
G D  
S
G
D S  
!
S
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
FQP13N50  
FQPF13N50  
Unit  
V
V
I
Drain-Source Voltage  
500  
DSS  
- Continuous (T = 25°C)  
Drain Current  
12.5  
7.9  
50  
12.5 *  
7.9 *  
50 *  
A
D
C
- Continuous (T = 100°C)  
A
C
I
(Note 1)  
Drain Current  
- Pulsed  
A
DM  
V
E
I
Gate-Source Voltage  
± 30  
810  
12.5  
17  
V
GSS  
AS  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
mJ  
V/ns  
W
AR  
dv/dt  
4.5  
P
Power Dissipation (T = 25°C)  
170  
56  
D
C
- Derate above 25°C  
Operating and Storage Temperature Range  
1.35  
0.45  
W/°C  
°C  
T , T  
-55 to +150  
300  
J
STG  
Maximum lead temperature for soldering purposes,  
T
°C  
L
1/8" from case for 5 seconds  
* Drain current limited by maximum junction temperature.  
Thermal Characteristics  
Symbol  
Parameter  
FQP13N50  
FQPF13N50  
Unit  
R
R
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Case-to-Sink  
0.74  
0.5  
2.23  
--  
°C/W  
°C/W  
θJC  
θCS  
www.fairchildsemi.com  
©2000 Fairchild Semiconductor Corporation  
FQP13N50 / FQPF13N50 Rev. C0  

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