TM
QFET
FQP13N50/FQPF13N50
500V N-Channel MOSFET
General Description
Features
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for high efficiency switch mode power supply, power
factor correction, electronic lamp ballast based on half
bridge.
•
•
•
•
•
•
12.5A, 500V, R
= 0.43Ω @V = 10 V
DS(on) GS
Low gate charge ( typical 45 nC)
Low Crss ( typical 25 pF)
Fast switching
100% avalanche tested
Improved dv/dt capability
D
!
●
◀
▲
●
●
G!
TO-220F
FQPF Series
TO-220
FQP Series
G D
S
G
D S
!
S
Absolute Maximum Ratings
T = 25°C unless otherwise noted
C
Symbol
Parameter
FQP13N50
FQPF13N50
Units
V
V
I
Drain-Source Voltage
500
DSS
- Continuous (T = 25°C)
Drain Current
12.5
7.9
50
12.5 *
7.9 *
50 *
A
D
C
- Continuous (T = 100°C)
A
C
I
(Note 1)
Drain Current
- Pulsed
A
DM
V
E
I
Gate-Source Voltage
± 30
810
12.5
17
V
GSS
AS
(Note 2)
(Note 1)
(Note 1)
(Note 3)
Single Pulsed Avalanche Energy
Avalanche Current
mJ
A
AR
E
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
mJ
V/ns
W
AR
dv/dt
4.5
P
Power Dissipation (T = 25°C)
170
56
D
C
- Derate above 25°C
Operating and Storage Temperature Range
1.35
0.45
W/°C
°C
T , T
-55 to +150
300
J
STG
Maximum lead temperature for soldering purposes,
T
°C
L
1/8" from case for 5 seconds
* Drain current limited by maximum junction temperature.
Thermal Characteristics
Symbol
Parameter
FQP13N50
FQPF13N50
Units
°C/W
°C/W
R
R
Thermal Resistance, Junction-to-Case
Thermal Resistance, Case-to-Sink
0.74
0.5
2.23
--
θJC
θCS
©2002 Fairchild Semiconductor Corporation
Rev. B, September 2002