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FQPF13N50 PDF预览

FQPF13N50

更新时间: 2024-11-15 22:14:31
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
10页 882K
描述
500V N-Channel MOSFET

FQPF13N50 数据手册

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TM  
QFET  
FQP13N50/FQPF13N50  
500V N-Channel MOSFET  
General Description  
Features  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary,  
planar stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode. These devices are well  
suited for high efficiency switch mode power supply, power  
factor correction, electronic lamp ballast based on half  
bridge.  
12.5A, 500V, R  
= 0.43@V = 10 V  
DS(on) GS  
Low gate charge ( typical 45 nC)  
Low Crss ( typical 25 pF)  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
D
!
G!  
TO-220F  
FQPF Series  
TO-220  
FQP Series  
G D  
S
G
D S  
!
S
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
FQP13N50  
FQPF13N50  
Units  
V
V
I
Drain-Source Voltage  
500  
DSS  
- Continuous (T = 25°C)  
Drain Current  
12.5  
7.9  
50  
12.5 *  
7.9 *  
50 *  
A
D
C
- Continuous (T = 100°C)  
A
C
I
(Note 1)  
Drain Current  
- Pulsed  
A
DM  
V
E
I
Gate-Source Voltage  
± 30  
810  
12.5  
17  
V
GSS  
AS  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
mJ  
V/ns  
W
AR  
dv/dt  
4.5  
P
Power Dissipation (T = 25°C)  
170  
56  
D
C
- Derate above 25°C  
Operating and Storage Temperature Range  
1.35  
0.45  
W/°C  
°C  
T , T  
-55 to +150  
300  
J
STG  
Maximum lead temperature for soldering purposes,  
T
°C  
L
1/8" from case for 5 seconds  
* Drain current limited by maximum junction temperature.  
Thermal Characteristics  
Symbol  
Parameter  
FQP13N50  
FQPF13N50  
Units  
°C/W  
°C/W  
R
R
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Case-to-Sink  
0.74  
0.5  
2.23  
--  
θJC  
θCS  
©2002 Fairchild Semiconductor Corporation  
Rev. B, September 2002  

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