®
QFET
FQB11P06 / FQI11P06
60V P-Channel MOSFET
General Description
Features
These P-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar stripe, DMOS technology.
•
•
•
•
•
•
•
-11.4A, -60V, R
= 0.175Ω @V = -10 V
DS(on) GS
Low gate charge ( typical 13 nC)
Low Crss ( typical 45 pF)
Fast switching
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand a high energy pulse in the
avalanche and commutation modes. These devices are
well suited for low voltage applications such as automotive,
DC/DC converters, and high efficiency switching for power
management in portable and battery operated products.
100% avalanche tested
Improved dv/dt capability
175°C maximum junction temperature rating
S
!
D
●
G
●
▶
●
!
▲
I2-PAK
D2-PAK
FQB Series
G
S
FQI Series
G D S
!
D
Absolute Maximum Ratings
T = 25°C unless otherwise noted
C
Symbol
Parameter
FQB11P06 / FQI11P06
Units
V
A
A
A
V
mJ
A
mJ
V/ns
W
V
I
Drain-Source Voltage
Drain Current
-60
-11.4
-8.05
-45.6
± 25
160
-11.4
5.3
-7.0
DSS
- Continuous (T = 25°C)
D
C
- Continuous (T = 100°C)
C
I
(Note 1)
Drain Current
Gate-Source Voltage
- Pulsed
DM
V
E
I
GSS
AS
(Note 2)
(Note 1)
(Note 1)
(Note 3)
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation (T = 25°C) *
AR
E
AR
dv/dt
3.13
53
P
A
D
Power Dissipation (T = 25°C)
W
C
- Derate above 25°C
Operating and Storage Temperature Range
0.35
-55 to +175
W/°C
°C
T , T
J
STG
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
T
300
°C
L
Thermal Characteristics
Symbol
Parameter
Typ
--
--
Max
2.85
40
Units
°C/W
°C/W
°C/W
R
R
R
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient *
Thermal Resistance, Junction-to-Ambient
θJC
θJA
θJA
--
62.5
* When mounted on the minimum pad size recommended (PCB Mount)
©2004 Fairchild Semiconductor Corporation
Rev. B5, March 2004