DATA SHEET
www.onsemi.com
MOSFET – P-Channel, Logic
Level, POWERTRENCH)
V
R
MAX
I MAX
D
DSS
DS(ON)
−40 V
13.5 mW @ −10 V
−50 A
-40 V, -50 A, 13.5 mW
D (5,6,7,8)
FDWS9510L-F085
Features
• Typ R
• Typ Q
= 11 mW at V = −10 V; I = −50 A
GS D
DS(on)
G (4)
= 28 nC at V = −10 V; I = −50 A
g(tot)
GS
D
• UIS Capability
S (1,2,3)
P−Channel MOSFET
• Wettable Flanks for Automatic Optical Inspection (AOI)
• AEC−Q101 Qualified
• These Devices are Pb−Free and are RoHS Compliant
Top
Bottom
Applications
D
D
D
D
• Automotive Engine Control
• Powertrain Management
• Solenoid and Motor Drivers
• Electronic Steering
• Integrated Starter/Alternator
• Distributed Power Architectures and VRM
• Primary Switch for 12 V Systems
G
S
S
S
Pin 1
DFNW8
CASE 507AU
MARKING DIAGRAM
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
−40
16
Unit
V
V
DSS
ON
AYWWWL
Gate−to−Source Voltage
V
GS
V
FDWS
9510L
Continuous Drain Current
GS
T
T
= 25°C
= 25°C
I
D
−50
A
C
(V = 10 V) (Note 1)
Pulsed Drain Current
See
Figure 4
C
A
Y
= Assembly Location
= Year
= Work Week
= Assembly Lot
= Device Code
= Device Code
Single Pulse Avalanche Energy (Note 2)
Power Dissipation
E
32
75
mJ
W
AS
P
D
WW
WL
FDWS
9510L
Derate above 25°C
0.5
W/°C
°C
Operating and Storage Temperature
T , T
−55 to
+175
J
STG
(Note: Microdot may be in either location)
Thermal Resistance (Junction−to−Case)
R
2
°C/W
°C/W
q
JC
JA
Maximum Thermal Resistance
(Junction−to−Ambient) (Note 3)
R
50
q
ORDERING INFORMATION
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Current is limited by wirebond configuration
†
Device
Package
Shipping
FDWS9510L−F085
DFNW8
(Power56)
(Pb−Free)
3000 /
Tape & Reel
2. Starting Tj = 25°C, L = 40 mH, I = −40 A, V
= −40 V during inductor
AS
DD
charging and V = 0 V during time in avalanche
DD
3. R
is the sum of the junction−to−case and case−to−ambient thermal
q
JA
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
resistance where the case thermal reference is defined as the solder
mounting surface of the drain pins. R
is guaranteed by design while R
q
JA
q
JC
is determined by the user’s board design. The maximum rating presented
2
here is based on mounting on a 1 in pad of 2 oz copper.
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
October, 2021 − Rev. 2
FDWS9510L−F085/D