DATA SHEET
www.onsemi.com
MOSFET – N-Channel,
POWERTRENCH)
V
MAX
r
MAX
I MAX
D
DSS
DS(on)
30 V
18 mW @ 10 V
21 mW @ 4.5 V
7.5 A
30 V, 7.5 A, 18 mW
D2
D2
FDS8978, FDS8978-F40
D1
D1
General Description
G2
S2
G1
S1
This N−Channel MOSFET has been designed specifically to
improve the overall efficiency of DC/DC converters using either
synchronous or conventional switching PWM controllers. It has been
Pin 1
SOIC8
CASE 751EB
optimized for low gate charge, low r
and fast switching speed.
DS(on)
Features
• r
• r
= 18 mW, V = 10 V, I = 7.5 A
GS D
DS(on)
DS(on)
MARKING DIAGRAM
= 21 mW, V = 4.5 V, I = 6.9 A
GS
D
• High Performance Trench Technology for Extremely Low r
• Low Gate Charge
DS(on)
FDS8978
ALYW
• High Power and Current Handling Capability
• 100% Rg Tested
• These Devices are Pb−Free and are RoHS Compliant
FDS8978 = Device Code
Applications
A
= Assembly Site
• DC/DC Converters
L
YW
= Wafer Lot Number
= Assembly Start Week
MOSFET MAXIMUM RATINGS (T = 25°C unless otherwise noted)
A
Symbol
Parameter
Drain to Source Voltage
Gate to Source Voltage
Ratings
30
Unit
V
PIN CONNECTIONS
V
DSS
V
GS
20
V
D2
G2
5
6
4
I
Drain
Continuous (T = 25°C,
7.5
A
D
A
Current
V
= 10 V, R
= 50°C/W)
JA
q
GS
D2
D1
D1
S2
G1
S1
Q2
Q1
3
2
Continuous (T = 25°C,
6.9
A
A
q
V
GS
= 4.5 V, R
= 50°C/W)
JA
7
8
Pulsed
49
57
A
mJ
1
E
AS
Single Pulse Avalanche Energy (Note 1)
Power Dissipation
P
1.6
W
D
Derate above 25°C
13
mW/°C
°C
T , T
Operating and Storage Temperature
–55 to 150
J
STG
ORDERING INFORMATION
See detailed ordering and shipping information on page 13 of
this data sheet.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Starting T = 25°C, L = 1 mH, I = 7.5 A, V = 30 V, V = 10 V.
J
AS
DD
GS
© Semiconductor Components Industries, LLC, 2007
1
Publication Order Number:
February, 2022 − Rev. 3
FDS8978/D