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FDS6875L99Z PDF预览

FDS6875L99Z

更新时间: 2024-11-20 15:32:19
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 开关脉冲光电二极管晶体管
页数 文件大小 规格书
5页 62K
描述
Power Field-Effect Transistor, 6A I(D), 20V, 0.03ohm, 2-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, SO-8

FDS6875L99Z 技术参数

生命周期:Obsolete零件包装代码:SOT
包装说明:SMALL OUTLINE, R-PDSO-G8针数:8
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.76
配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:20 V
最大漏极电流 (ID):6 A最大漏源导通电阻:0.03 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-G8
元件数量:2端子数量:8
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:P-CHANNEL
最大脉冲漏极电流 (IDM):20 A认证状态:Not Qualified
表面贴装:YES端子形式:GULL WING
端子位置:DUAL晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDS6875L99Z 数据手册

 浏览型号FDS6875L99Z的Datasheet PDF文件第2页浏览型号FDS6875L99Z的Datasheet PDF文件第3页浏览型号FDS6875L99Z的Datasheet PDF文件第4页浏览型号FDS6875L99Z的Datasheet PDF文件第5页 
November 1998  
FDS6875  
Dual P-Channel 2.5V Specified PowerTrenchTM MOSFET  
General Description  
Features  
-6 A, -20 V. RDS(ON) = 0.030 W @ VGS = -4.5 V,  
RDS(ON) = 0.040 W @ VGS = -2.5 V.  
These P-Channel  
2.5V specified MOSFETs are  
produced using Fairchild Semiconductor's advanced  
PowerTrench process that has been especially tailored to  
minimize the on-state resistance and yet maintain low gate  
charge for superior switching performance.  
Low gate charge (23nC typical).  
High performance trench technology for extremely low  
These devices are well suited for portable electronics  
applications: load switching and power management,  
RDS(ON)  
.
High power and current handling capability.  
battery charging and protection circuits.  
SuperSOTTM-6  
SuperSOTTM-8  
SOIC-16  
SOT-23  
SO-8  
SOT-223  
D2  
4
5
6
7
8
D2  
D1  
D1  
3
2
1
G2  
S2  
G1  
pin 1  
SO-8  
S1  
Absolute Maximum Ratings  
TA = 25oC unless otherwise noted  
Symbol Parameter  
FDS6875  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
-20  
±8  
V
VDSS  
VGSS  
ID  
V
A
Drain Current - Continuous  
- Pulsed  
(Note 1a)  
-6  
-20  
PD  
Power Dissipation for Dual Operation  
Power Dissipation for Single Operation  
2
W
(Note 1a)  
1.6  
(Note 1b)  
(Note 1c)  
1
0.9  
Operating and Storage Temperature Range  
-55 to 150  
°C  
TJ,TSTG  
THERMAL CHARACTERISTICS  
RqJA  
RqJC  
Thermal Resistance, Junction-to-Ambient (Note 1a)  
Thermal Resistance, Junction-to-Case  
78  
40  
°C/W  
°C/W  
(Note 1)  
FDS6875 Rev.C  
© 1998 Fairchild Semiconductor Corporation  

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