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FDD8770 PDF预览

FDD8770

更新时间: 2024-10-29 11:14:31
品牌 Logo 应用领域
安森美 - ONSEMI 开关脉冲晶体管
页数 文件大小 规格书
8页 560K
描述
N 沟道,PowerTrench® MOSFET,25V,35A,4.0mΩ

FDD8770 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
Factory Lead Time:1 week风险等级:0.99
雪崩能效等级(Eas):113 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:25 V
最大漏极电流 (Abs) (ID):35 A最大漏极电流 (ID):35 A
最大漏源导通电阻:0.0055 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-252AAJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):115 W
最大脉冲漏极电流 (IDM):407 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDD8770 数据手册

 浏览型号FDD8770的Datasheet PDF文件第1页浏览型号FDD8770的Datasheet PDF文件第3页浏览型号FDD8770的Datasheet PDF文件第4页浏览型号FDD8770的Datasheet PDF文件第5页浏览型号FDD8770的Datasheet PDF文件第6页浏览型号FDD8770的Datasheet PDF文件第7页 
March 2015  
FDD8770/FDU8770  
N-Channel PowerTrench® MOSFET  
25V, 35A, 4.0mΩ  
General Description  
Features  
„ Max rDS(on) =4.0mat VGS = 10V, ID = 35A  
„ Max rDS(on) =5.5mat VGS = 4.5V, ID = 35A  
„ Low gate charge: Qg(10) = 52nC(Typ), VGS = 10V  
„ Low gate resistance  
This N-Channel MOSFET has been designed specifically  
to improve the overall efficiency of DC/DC converters using  
either synchronous or conventional switching PWM  
controllers. It has been optimized for low gate charge, low  
rDS(on) and fast switching speed.  
„ RoHS Compliant  
Application  
„ Vcore DC-DC for Desktop Computers and Servers  
„ VRM for Intermediate Bus Architecture  
D
G
D
G
S
I-PAK  
G
D S  
Short Lead I-PAK  
(TO-251AA)  
S
MOSFET Maximum Ratings TC = 25°C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
25  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
V
V
±20  
Drain Current -Continuous (Package Limited)  
-Continuous (Die Limited)  
-Pulsed  
35  
ID  
210  
A
(Note 1)  
(Note 2)  
407  
EAS  
Single Pulse Avalanche Energy  
Power Dissipation  
113  
mJ  
W
PD  
115  
TJ, TSTG  
Operating and Storage Temperature  
-55 to 175  
°C  
Thermal Characteristics  
RθJC  
RθJA  
RθJA  
Thermal Resistance, Junction to Case TO-252,TO-251  
Thermal Resistance, Junction to Ambient TO-252,TO-251  
Thermal Resistance, Junction to Ambient TO-252,1in2 copper pad area  
1.3  
100  
52  
°C/W  
°C/W  
°C/W  
Package Marking and Ordering Information  
Device Marking  
FDD8770  
Device  
FDD8770  
Package  
TO-252AA  
TO-251AA  
TO-251AA  
Reel Size  
13’’  
Tape Width  
16mm  
N/A  
Quantity  
2500 units  
75 units  
FDU8770  
FDU8770  
N/A(Tube)  
N/A(Tube)  
FDU8770  
FDU8770_F071  
N/A  
75 units  
©2006 Fairchild Semiconductor Corporation  
FDD8770/FDU8770 Rev. 1.2  
1
www.fairchildsemi.com  

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