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FDC6325L PDF预览

FDC6325L

更新时间: 2024-11-26 11:10:55
品牌 Logo 应用领域
安森美 - ONSEMI 开关驱动光电二极管接口集成电路驱动器
页数 文件大小 规格书
5页 304K
描述
集成式负载开关

FDC6325L 数据手册

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DATA SHEET  
www.onsemi.com  
Integrated Load Switch  
FDC6325L  
1
TSOT23 6Lead  
CASE 419BL  
General Description  
This device is particularly suited for compact power management in  
portable electronic equipment where 2.5 V to 8 V input and 1.8 A  
output current capability are needed. This load switch integrates a  
small NChannel power MOSFET (Q1) which drives a large  
PChannel power MOSFET (Q2) in one tiny SUPERSOTt6  
package.  
MARKING DIAGRAM  
XXX MG  
G
Features  
1
V  
= 0.2 V @ V = 5 V, I = 1.5 A, R  
= 0.13 W  
DROP  
DROP  
DROP  
IN  
L
(ON)  
XXX = Specific Device Code  
M
= Date Code  
V
= 0.2 V @ V = 3.3 V, I = 1.2 A, R = 0.16 W  
IN  
L
(ON)  
G
= PbFree Package  
(Note: Microdot may be in either location)  
V
= 0.2 V @ V = 2.5 V, I = 1 A, R  
= 0.18 W  
IN  
L
(ON)  
SUPERSOTt6 Package Design Using Copper Lead Frame for  
Superior Thermal and Electrical Capabilities  
This is a PbFree Device  
PINOUT  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)  
Vout,C1  
3
2
1
Vin,R1  
4
5
6
Symbol  
Parameter  
Input Voltage Range  
On/Off Voltage Range  
Load Current  
Continuous (Note 1)  
Pulsed (Notes 1 & 3)  
Ratings  
2.8 8  
1.5 8  
1.8  
Unit  
V
Q2  
V
IN  
ON/OFF  
ON/OFF  
Vout,C1  
R2  
V
V
Q1  
I
L
A
R1,C1  
5
P
Maximum Power Dissipation (Note 2)  
0.7  
W
°C  
kV  
D
T , T  
Operating and Storage Temperature Range  
55 to 150  
6
J
STG  
(See Application Circuit)  
ESD  
Electrostatic Discharge Rating  
MILSTD883D Human Body Model  
(100 pF / 1500 W)  
EQUIVALENT CIRCUIT  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
V
DROP  
+
1. V = 8 V, V  
= 8 V, TA = 25°C  
IN  
ON/OFF  
OUT  
IN  
2. R  
is the sum of the junctiontocase and casetoambient thermal  
q
JA  
resistance where the case thermal reference is defined as the solder  
mounting surface of the drain pins. R  
is guaranteed by design while R  
q
CA  
q
JC  
ON/OFF  
is determined by the user’s board design.  
THERMAL CHARACTERISTICS  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
Symbol  
Parameter  
Ratings  
Unit  
RqJA  
Thermal Resistance, JunctiontoAmbient  
(Note 2)  
180  
°C/W  
RqJC  
Thermal Resistance, JunctiontoCase  
(Note 2)  
60  
°C/W  
© Semiconductor Components Industries, LLC, 1998  
1
Publication Order Number:  
March, 2022 Rev. 5  
FDC6325L/D  
 

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