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FDC5612 PDF预览

FDC5612

更新时间: 2023-09-03 20:36:43
品牌 Logo 应用领域
安森美 - ONSEMI PC开关光电二极管晶体管
页数 文件大小 规格书
7页 319K
描述
N 沟道 PowerTrench® MOSFET 60V,4.3A,55mΩ

FDC5612 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-G6Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
Factory Lead Time:21 weeks风险等级:0.96
Samacsys Confidence:3Samacsys Status:Released
Samacsys PartID:166980Samacsys Pin Count:6
Samacsys Part Category:Integrated CircuitSamacsys Package Category:SOT23 (6-Pin)
Samacsys Footprint Name:SSOT 6LSamacsys Released Date:2015-04-13 16:42:53
Is Samacsys:N配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (Abs) (ID):4.3 A
最大漏极电流 (ID):4.3 A最大漏源导通电阻:0.055 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-G6
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:6
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):1.6 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin (Sn)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDC5612 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET – N-Channel,  
POWERTRENCH)  
V
R
MAX  
I MAX  
D
DSS  
DS(ON)  
60 V  
@
1
0
V
4.3 A  
ꢂ ꢃ ꢂ ꢅ ꢆ ꢀ @ 6 V  
60 V  
S
FDC5612  
D
D
G
D
General Description  
D
This NChannel MOSFET has been designed specifically to  
improve the overall efficiency of DC/DC converters using either  
synchronous or conventional switching PWM controllers.  
These MOSFETs feature faster switching and lower gate charge  
TSOT23 6Lead  
(SUPERSOTt6)  
CASE 419BL  
than other MOSFETs with comparable R  
specifications.  
DS(ON)  
MARKING DIAGRAM  
The result is a MOSFET that is easy and safer to drive (even at very  
high frequencies), and DC/DC power supply designs with higher  
overall efficiency.  
562 MG  
G
Features  
4.3 A, 60 V.  
R
R
= 0.055 @ V = 10 V  
GS  
DS(ON)  
= 0.064 @ V = 6 V  
DS(ON)  
GS  
562  
M
G
= Specific Device Code  
= Date Code  
= PbFree Package  
Low Gate Charge (12.5 nC Typical)  
Fast Switching Speed  
(Note: Microdot may be in either location)  
High Performance Trench Technology for Extremely Low R  
.
DS(ON)  
TM  
SUPERSOT 6 Package: Small Footprint  
PIN ASSIGNMENT  
(72% Smaller than Standard SO8); Low Profile (1mm Thick).  
This is a PbFree and Halide Free Device  
1
2
3
6
5
4
ABSOLUTE MAXIMUM RATINGS T = 25°C unless otherwise noted  
A
Symbol  
Parameter  
DrainSource Voltage  
Value  
60  
Unit  
V
V
DSS  
V
GSS  
GateSource Voltage  
20  
V
I
D
Drain Current  
A
Continuous (Note 1a)  
4.3  
20  
ORDERING INFORMATION  
Pulsed  
Device  
Package  
Shipping  
3000 /  
Tape & Reel  
P
Power Dissipation for Single Operation  
(Note 1a)  
W
D
1.6  
0.8  
TSOT236  
(SUPERSOTt6)  
(PbFree)  
FDC5612  
(Note 1b)  
T , T  
J
Operating and Storage Junction  
Temperature Range  
55 to +150  
°C  
stg  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Value  
Unit  
R
Thermal Resistance,  
JunctiontoAmbient (Note 1a)  
78  
°C/W  
JA  
R
Thermal Resistance,  
JunctiontoCase (Note 1)  
30  
°C/W  
JC  
© Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
June, 2022 Rev. 4  
FDC5612/D  

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