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DMN3150LW PDF预览

DMN3150LW

更新时间: 2024-11-07 09:54:15
品牌 Logo 应用领域
美台 - DIODES 晶体晶体管
页数 文件大小 规格书
4页 163K
描述
N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR

DMN3150LW 数据手册

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DMN3150LW  
N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR  
Please click here to visit our online spice models database.  
Features  
Mechanical Data  
Low On-Resistance:  
RDS(ON) < 88m@ VGS = 4.5V  
DS(ON) < 138m@ VGS = 2.5V  
Case: SOT-323  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
R
Moisture Sensitivity: Level 1 per J-STD-020D  
Terminals: Finish - Matte Tin annealed over Alloy 42  
leadframe. Solderable per MIL-STD-202, Method 208  
Terminal Connections: See Diagram  
Marking Information: See Page 3  
Ordering Information: See Page 3  
Weight: 0.006 grams (approximate)  
Low Gate Threshold Voltage  
Low Input Capacitance  
Fast Switching Speed  
Low Input/Output Leakage  
Lead Free By Design/RoHS Compliant (Note 2)  
"Green" Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
Drain  
SOT-323  
D
Gate  
G
S
Source  
EQUIVALENT CIRCUIT  
Pin Configuration  
TOP VIEW  
Maximum Ratings @TA = 25°C unless otherwise specified  
Characteristic  
Drain Source Voltage  
Gate-Source Voltage  
Symbol  
VDSS  
VGSS  
Value  
28  
Unit  
V
V
±12  
Drain Current (Note 1)  
TA = 25°C  
TA = 70°C  
Pulsed  
1.6  
1.2  
A
ID  
Drain Current (Note 1)  
Body-Diode Continuous Current (Note 1)  
6.4  
1.5  
A
A
IDM  
IS  
Thermal Characteristics  
Characteristic  
Total Power Dissipation (Note 1)  
Symbol  
Value  
350  
Unit  
mW  
°C/W  
°C  
PD  
357  
Thermal Resistance, Junction to Ambient @TA = 25°C (Note 1)  
Operating and Storage Temperature Range  
Rθ  
JA  
-55 to +150  
TJ, TSTG  
Electrical Characteristics @TA = 25°C unless otherwise specified  
Characteristic  
OFF CHARACTERISTICS (Note 4)  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
28  
V
BVDSS  
IDSS  
800  
VGS = 0V, ID = 250μA  
VDS = 28V, VGS = 0V  
VGS = ±12V, VDS = 0V  
VGS = ±19V, VDS = 0V  
nA  
±80  
±800  
Gate-Body Leakage  
nA  
IGSS  
ON CHARACTERISTICS (Note 4)  
Gate Threshold Voltage  
0.62  
0.94  
1.4  
V
VGS(th)  
VDS = VGS, ID = 250μA  
VGS = 4.5V, ID = 1.6A  
VGS = 2.5V, ID = 1.2A  
VDS = 5V, ID = 2.7A  
VGS = 0V, IS = 1.5A  
73  
115  
88  
138  
Static Drain-Source On-Resistance  
RDS(ON)  
mΩ  
Forward Transconductance  
Source-Drain Diode Forward Voltage  
DYNAMIC CHARACTERISTICS  
Input Capacitance  
5.4  
S
V
|Yfs|  
VSD  
1.16  
305  
74  
pF  
pF  
pF  
Ciss  
Coss  
Crss  
VDS = 5V, VGS = 0V  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
48  
Notes:  
1. Device mounted on 1in2 FR-4 PCB on 2oz. Copper. t 10 sec.  
2. No purposefully added lead.  
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.  
4. Short duration pulse test used to minimize self-heating effect.  
1 of 4  
www.diodes.com  
August 2008  
© Diodes Incorporated  
DMN3150LW  
Document number: DS31514 Rev. 1 - 2  

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