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Datasheet > DDB6U134N16RRB11BPSA1
DDB6U134N16RRB11BPSA1 PDF预览

DDB6U134N16RRB11BPSA1

更新时间： 2024-11-06 19:56:39
品牌 Logo 应用领域
英飞凌 - INFINEON 局域网栅功率控制晶体管
页数 文件大小 规格书
4页 609K
描述
Insulated Gate Bipolar Transistor, 70A I(C), 1200V V(BR)CES, N-Channel, MODULE-19

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中文翻译

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DDB6U134N16RRB11BPSA1 技术参数

是否Rohs认证： 符合生命周期：Active
包装说明：FLANGE MOUNT, R-XUFM-X19Reach Compliance Code：compliant
ECCN代码：EAR99Factory Lead Time：1 week
风险等级：5.6外壳连接：ISOLATED
最大集电极电流 (IC)：70 A集电极-发射极最大电压：1200 V
配置：SINGLE WITH BUILT-IN DIODE, THREE PHASE DIODE BRIDGE AND THERMISTORJESD-30 代码：R-XUFM-X19
元件数量：1端子数量：19
最高工作温度：150 °C封装主体材料：UNSPECIFIED
封装形状：RECTANGULAR封装形式：FLANGE MOUNT
峰值回流温度（摄氏度）：NOT SPECIFIED极性/信道类型：N-CHANNEL
表面贴装：NO端子形式：UNSPECIFIED
端子位置：UPPER处于峰值回流温度下的最长时间：NOT SPECIFIED
晶体管应用：POWER CONTROL晶体管元件材料：SILICON
Base Number Matches：1

DDB6U134N16RRB11BPSA1 数据手册

 浏览型号DDB6U134N16RRB11BPSA1的Datasheet PDF文件第2页浏览型号DDB6U134N16RRB11BPSA1的Datasheet PDF文件第3页浏览型号DDB6U134N16RRB11BPSA1的Datasheet PDF文件第4页 
Product Brief  
PressFIT  
Our established, reliable mounting technology  
Infineon’s established PressFIT technology offers the possibility for reliable, solder-less  
mounting of power modules, meeting the nowadays demands of lead-free technology.  
According to the RoHS directive, since 2006 most lead-containing solder alloys have to be  
replaced by lead-free solders. This results in higher melting point solders and lead-free tin  
metallization of the PCB, which has significant effects on the mounting process.  
Key features  
PressFIT saves process time  
›
Reliable cold welding connection  
of module pins and PCB  
Low ohmic resistance  
›
›
›
PressFIT technology is one time-saving possibility for lead-free solderless mounting of  
power modules. The low electrical and thermal contact resistance makes the contact  
suitable for a wide range of currents and applications.  
Module mounting possible on  
soldering and component side  
of PCB  
Established technology in  
automotive, communication &  
industrial applications  
Decrease of FIT rate  
›
›
Environmental tests show that vibration loads and climate sequences have no negative  
influence on the contact resistance. This results from the gas-tight contact and high  
contact force. The high holding forces of the contact are independent of the PCB hole  
tolerances. This reduces the effort for mechanical fixing.  
The PressFIT process can be separated from soldering and allows module mounting on  
the soldering and the component side of the PCB. This increases the design flexibility.  
Additionally, the module mounting process can be separated from the soldering process  
of the PCB. The high reliability of PressFIT contacts in general promises increased system  
reliability. This is especially of interest if modules are operating in harsh environments.  
Applications  
Industrial drives  
›
Uninterruptable power supplies  
Renewable energy systems  
Air conditioning  
›
›
›
›
›
›
›
Welding  
Inductive heating  
Medical equipment  
Commercial and agricultural  
vehicles (CAV)  
www.infineon.com/IGBTmodules  
1234

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