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CY7C1019CV33-15VI PDF预览

CY7C1019CV33-15VI

更新时间: 2024-11-13 22:25:51
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 存储内存集成电路静态存储器光电二极管
页数 文件大小 规格书
8页 196K
描述
128K x 8 Static RAM

CY7C1019CV33-15VI 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:SOJ包装说明:0.400 INCH, PLASTIC, SOJ-32
针数:32Reach Compliance Code:not_compliant
ECCN代码:3A991.B.2.BHTS代码:8542.32.00.41
风险等级:5.21Is Samacsys:N
最长访问时间:15 nsI/O 类型:COMMON
JESD-30 代码:R-PDSO-J32JESD-609代码:e0
长度:20.955 mm内存密度:1048576 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
湿度敏感等级:2功能数量:1
端子数量:32字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:128KX8输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:SOJ
封装等效代码:SOJ32,.44封装形状:RECTANGULAR
封装形式:SMALL OUTLINE并行/串行:PARALLEL
峰值回流温度(摄氏度):225电源:3.3 V
认证状态:Not Qualified座面最大高度:3.7592 mm
最大待机电流:0.005 A最小待机电流:3 V
子类别:SRAMs最大压摆率:0.07 mA
最大供电电压 (Vsup):3.63 V最小供电电压 (Vsup):2.97 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:J BEND
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30宽度:10.16 mm
Base Number Matches:1

CY7C1019CV33-15VI 数据手册

 浏览型号CY7C1019CV33-15VI的Datasheet PDF文件第2页浏览型号CY7C1019CV33-15VI的Datasheet PDF文件第3页浏览型号CY7C1019CV33-15VI的Datasheet PDF文件第4页浏览型号CY7C1019CV33-15VI的Datasheet PDF文件第5页浏览型号CY7C1019CV33-15VI的Datasheet PDF文件第6页浏览型号CY7C1019CV33-15VI的Datasheet PDF文件第7页 
CY7C1019CV33  
128K x 8 Static RAM  
device has an automatic power-down feature that significantly  
reduces power consumption when deselected.  
Features  
• Pin and function compatible with CY7C1019BV33  
• High speed  
Writing to the device is accomplished by taking Chip Enable  
(CE) and Write Enable (WE) inputs LOW. Data on the eight I/O  
pins (I/O0 through I/O7) is then written into the location  
specified on the address pins (A0 through A16).  
— tAA = 8, 10, 12, 15 ns  
• CMOS for optimum speed/power  
• Data retention at 2.0V  
• Center power/ground pinout  
• Automatic power-down when deselected  
• Easy memory expansion with CE and OE options  
• Available in 32-pin TSOP II and 400-mil SOJ package  
Reading from the device is accomplished by taking Chip  
Enable (CE) and Output Enable (OE) LOW while forcing Write  
Enable (WE) HIGH. Under these conditions, the contents of  
the memory location specified by the address pins will appear  
on the I/O pins.  
The eight input/output pins (I/O0 through I/O7) are placed in a  
high-impedance state when the device is deselected (CE  
HIGH), the outputs are disabled (OE HIGH), or during a write  
operation (CE LOW, and WE LOW).  
Functional Description  
The CY7C1019CV33 is a high-performance CMOS static  
RAM organized as 131,072 words by 8 bits. Easy memory  
expansion is provided by an active LOW Chip Enable (CE), an  
active LOW Output Enable (OE), and three-state drivers. This  
The CY7C1019CV33 is available in a standard 32-pin TSOP  
II and 400-mil-wide SOJ.  
Logic Block Diagram  
Pin Configuration  
SOJ/TSOP II  
Top View  
A
A
A
A
A
32  
1
0
1
16  
31  
30  
2
3
4
5
6
15  
2
A
14  
A
13  
I/O  
A
29  
28  
3
0
INPUT BUFFER  
CE  
OE  
I/O  
I/O  
I/O  
27  
26  
1
I/O  
A
0
0
1
7
A
A
2
1
I/O  
V
7
8
9
6
I/O  
2
25  
24  
23  
22  
21  
V
CC  
A
SS  
3
V
A
I/O  
V
CC  
I/O  
4
SS  
3
512 x 256 x 8  
ARRAY  
A
5
I/O  
I/O  
10  
11  
12  
13  
2
3
5
4
A
6
I/O  
I/O  
A
4
A
7
A
8
WE  
12  
I/O  
A
A
5
4
11  
20  
19  
A
A
A
A
10  
5
14  
15  
16  
I/O  
6
POWER  
DOWN  
A
9
A
8
COLUMN  
DECODER  
6
18  
17  
CE  
7
I/O  
WE  
7
OE  
Selection Guide  
7C1019CV33-8 7C1019CV33-10 7C1019CV33-12 7C1019CV33-15 Unit  
Maximum Access Time  
8
85  
5
10  
80  
5
12  
75  
5
15  
70  
5
ns  
Maximum Operating Current  
Maximum Standby Current  
mA  
mA  
Cypress Semiconductor Corporation  
Document #: 38-05130 Rev. *D  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Revised December 16, 2002  

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