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CSD87501L_15 PDF预览

CSD87501L_15

更新时间: 2024-11-21 01:12:43
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德州仪器 - TI /
页数 文件大小 规格书
12页 896K
描述
CSD87501L 30 V Dual Common Drain N-Channel NexFET Power MOSFET

CSD87501L_15 数据手册

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Sample &  
Buy  
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Community  
Product  
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Software  
Technical  
Documents  
CSD87501L  
SLPS523A FEBRUARY 2015REVISED APRIL 2015  
CSD87501L 30 V Dual Common Drain N-Channel NexFET™ Power MOSFET  
1 Features  
Product Summary  
1
Low On-Resistance  
Small Footprint of 3.37 × 1.47 mm  
Ultra-Low Profile – 0.2 mm High  
Pb-Free  
TA = 25°C  
VS1S2  
Qg  
TYPICAL VALUE  
UNIT  
V
Source-to-Source Voltage  
Gate Charge Total (4.5 V)  
Gate Charge Gate-to-Drain  
30  
15  
nC  
nC  
m  
mΩ  
V
Qgd  
6.0  
VGS = 4.5 V  
VGS = 10 V  
1.8  
9.3  
6.6  
RoHS Compliant  
Source-to-Source On-  
Resistance  
RS1S2(on)  
VGS(th)  
Halogen Free  
Threshold Voltage  
Gate ESD Protection  
.
2 Applications  
Ordering Information(1)  
Battery Management  
Battery Protection  
USB Type-C /PD  
Device  
Media  
Qty  
Package  
Ship  
CSD87501L  
7-Inch Reel  
3000  
3.37 mm X 1.47 mm  
Land Grid Array  
Package  
Tape and  
Reel  
CSD87501LT 7-Inch Reel  
250  
(1) For all available packages, see the orderable addendum at  
the end of the data sheet.  
3 Description  
This 30 V, 6.6 mΩ, 3.37 mm × 1.47 mm LGA Dual  
NexFET™ power MOSFET is designed to minimize  
resistance and gate charge in a small footprint. Its  
small size and common drain configuration make the  
device ideal for multi-cell battery pack applications  
and small handheld devices.  
Absolute Maximum Ratings  
TA = 25°C  
VALUE  
UNIT  
V
VS1S2 Source-to-Source Voltage  
30  
VGS  
IS  
Gate-to-Source Voltage  
Continuous Source Current(1)  
±20  
14  
V
A
(2)  
ISM  
PD  
Pulsed Source Current  
72  
A
Top View  
Power Dissipation  
2.5  
W
V(ESD)  
Rating  
Human Body Model (HBM)  
2
kV  
°C  
S1  
S2  
S1  
S2  
G1  
G2  
S1  
S2  
S1  
S2  
TJ,  
Tstg  
Operating Junction and  
Storage Temperature Range  
–55 to 150  
(1) Typical RθJA = 50°C/W on a 1 inch2, 2 oz. Cu pad on a 0.06  
inch thick FR4 PCB.  
.
(2) Typical min Cu RθJA = 135°C/W, pulse duration 100 μs, duty  
cycle 1%.  
Configuration  
Source 1  
Source 2  
Gate 1  
Gate 2  
RS1S2(on) vs VGS  
Gate Charge  
24  
21  
18  
15  
12  
9
10  
TC = 25°C, I S = 7 A  
TC = 125°C, I S = 7 A  
IS = 7 A, VS1S2 = 15 V  
9
8
7
6
5
4
3
2
1
0
6
3
0
0
2
4
6
8
10  
12  
14  
16  
18  
20  
0
4
8
12  
16  
20  
24  
28  
32  
VGS - Gate-to-Source Voltage (V)  
Qg - Gate Charge (nC)  
D007  
D004  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
 
 
 
 
 
 

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