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CSD87335Q3D PDF预览

CSD87335Q3D

更新时间： 2024-01-14 02:40:42
品牌 Logo 应用领域
德州仪器 - TI 开关光电二极管
页数 文件大小 规格书
23页 850K
描述
采用 3mm x 3mm SON 封装的 25A、30V、N 沟道同步降压 NexFET™ 功率 MOSFET 电源块

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CSD87335Q3D 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：HLSSOP,
Reach Compliance Code：not_compliantECCN代码：EAR99
Factory Lead Time：1 week风险等级：1.69
模拟集成电路 - 其他类型：SWITCHING CONTROLLER控制技术：PULSE WIDTH MODULATION
最大输入电压：27 V标称输入电压：12 V
JESD-30 代码：S-PDSO-G8JESD-609代码：e3
长度：3.2 mm湿度敏感等级：1
功能数量：1端子数量：8
最高工作温度：150 °C最低工作温度：-55 °C
封装主体材料：PLASTIC/EPOXY封装代码：HLSSOP
封装形状：SQUARE封装形式：SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH
座面最大高度：1.5 mm最大供电电流 (Isup)：20 mA
表面贴装：YES切换器配置：BUCK
最大切换频率：1500 kHz温度等级：MILITARY
端子面层：Matte Tin (Sn)端子形式：GULL WING
端子节距：0.65 mm端子位置：DUAL
宽度：3.2 mmBase Number Matches：1

CSD87335Q3D 数据手册

 浏览型号CSD87335Q3D的Datasheet PDF文件第17页浏览型号CSD87335Q3D的Datasheet PDF文件第18页浏览型号CSD87335Q3D的Datasheet PDF文件第19页浏览型号CSD87335Q3D的Datasheet PDF文件第20页浏览型号CSD87335Q3D的Datasheet PDF文件第22页浏览型号CSD87335Q3D的Datasheet PDF文件第23页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
2500  
250  
(1)  
(2)  
(3)  
(4/5)  
(6)  
CSD87335Q3D  
CSD87335Q3DT  
ACTIVE  
LSON-CLIP  
LSON-CLIP  
DQZ  
8
8
RoHS-Exempt  
& Green  
NIPDAU | SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-55 to 150  
-55 to 150  
87335D  
87335D  
ACTIVE  
DQZ  
RoHS-Exempt  
& Green  
NIPDAU | SN  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
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